Inventor · disambiguated record
Kensou Ochiai
Also filed as: OCHIAI KENSOU
4 granted patents·1 pending application·6 citations·filing 2007–2017
62Inventor score
Files withKYOCERA CORP5
Top patents by PatentIndex Score
5 records- 0175US10014237B2Circuit board having a heat dissipating sheet with varying metal grain sizeKYOCERA CORP·Filed 2015·Granted Jul 3, 2018·4 cites·8 claims
- 0265US10037928B2Circuit board and electronic deviceKYOCERA CORP·Filed 2016·Granted Jul 31, 2018·2 cites·20 claims
- 0353US10657337B2RFID tag and RFID systemKYOCERA CORP·Filed 2017·Granted May 19, 2020·0 cites·19 claims
- 0437US2011038132A1Microstructure Apparatus, Manufacturing Method Thereof, and Sealing SubstrateKYOCERA CORP·Filed 2007·Application pending·0 cites
- 0534US10763184B2Power module substrate, power module, and method for manufacturing power module substrateKYOCERA CORP·Filed 2017·Granted Sep 1, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →