Inventor · disambiguated record
Hui Joong Kim
Also filed as: KIM HUI JOONG
4 granted patents·5 pending applications·1 citations·filing 2014–2025
56Inventor score
Files withMK ELECTRON CO LTD9
Top patents by PatentIndex Score
9 records- 0179US11646285B2Semiconductor package using core material for reverse reflowMK ELECTRON CO LTD·Filed 2021·Granted May 9, 2023·1 cites·6 claims
- 0269US12030140B2Lead-free solder alloy and method of manufacturing electronic device using the sameMK ELECTRON CO LTD·Filed 2022·Granted Jul 9, 2024·0 cites·7 claims
- 0358US2022212293A1Lead-free solder alloy, solder paste comprising the same, and semiconductor device comprising the sameMK ELECTRON CO LTD·Filed 2021·Application pending·0 cites
- 0454US9391039B2Solder balls and semiconductor device employing the sameMK ELECTRON CO LTD·Filed 2014·Granted Jul 12, 2016·0 cites·11 claims
- 0550US9156111B2Lead free solder bumpsMK ELECTRON CO LTD·Filed 2014·Granted Oct 13, 2015·0 cites·13 claims
- 0645US2021375811A1Pin-grid-array-type semiconductor packageMK ELECTRON CO LTD·Filed 2021·Application pending·0 cites
- 0741US2025226344A1Core ball and semiconductor package including the sameMK ELECTRON CO LTD·Filed 2025·Application pending·0 cites
- 0826US2016315040A1Core for reverse reflow, semiconductor package, and method of fabricating semiconductor packageMK ELECTRON CO LTD·Filed 2016·Application pending·0 cites
- 0926US2016256962A1Lead-free solder having low melting pointMK ELECTRON CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →