Inventor · disambiguated record
Thomas Dixon Dudderar
Also filed as: DUDDERAR THOMAS D · DUDDERAR THOMAS DIXON
30 granted patents·2,924 citations·filing 1977–2001
98Inventor score
Files withLUCENT TECHNOLOGIES INC15AGERE SYST GUARDIAN CORP6AT & T BELL LAB3AT & T CORP3AGERE SYSTEMS INC2
Top patents by PatentIndex Score
30 records- 0198US5646828AThin packaging of multi-chip modules with enhanced thermal/power managementLUCENT TECHNOLOGIES INC·Filed 1996·Granted Jul 8, 1997·359 cites·5 claims
- 0298US5608262APackaging multi-chip modules without wire-bond interconnectionLUCENT TECHNOLOGIES INC·Filed 1995·Granted Mar 4, 1997·449 cites·15 claims
- 0397US6734539B2Stacked module packageLUCENT TECHNOLOGIES INC·Filed 2001·Granted May 11, 2004·227 cites·17 claims
- 0497US6297551B1Integrated circuit packages with improved EMI characteristicsAGERE SYST GUARDIAN CORP·Filed 1999·Granted Oct 2, 2001·210 cites·10 claims
- 0596US6678167B1High performance multi-chip IC packageAGERE SYSTEMS INC·Filed 2000·Granted Jan 13, 2004·109 cites·10 claims
- 0696US6437990B1Multi-chip ball grid array IC packagesAGERE SYST GUARDIAN CORP·Filed 2000·Granted Aug 20, 2002·110 cites·7 claims
- 0796US6433411B1Packaging micromechanical devicesAGERE SYST GUARDIAN CORP·Filed 2000·Granted Aug 13, 2002·113 cites·16 claims
- 0896US5346118ASurface mount solder assembly of leadless integrated circuit packages to substratesAT & T BELL LAB·Filed 1993·Granted Sep 13, 1994·243 cites·20 claims
- 0994US5473512AElectronic device package having electronic device boonded, at a localized region thereof, to circuit boardAT & T CORP·Filed 1994·Granted Dec 5, 1995·170 cites·29 claims
- 1093US6396711B1Interconnecting micromechanical devicesAGERE SYST GUARDIAN CORP·Filed 2000·Granted May 28, 2002·115 cites·12 claims
- 1190US6175158B1Interposer for recessed flip-chip packageLUCENT TECHNOLOGIES INC·Filed 1998·Granted Jan 16, 2001·115 cites·19 claims
- 1282US5767447AElectronic device package enclosed by pliant medium laterally confined by a plastic rim memberLUCENT TECHNOLOGIES INC·Filed 1995·Granted Jun 16, 1998·67 cites·6 claims
- 1381US5990564AFlip chip packaging of memory chipsLUCENT TECHNOLOGIES INC·Filed 1997·Granted Nov 23, 1999·61 cites·16 claims
- 1481US4928527AMethod and device for nondestructive evaluationAT & T BELL LAB·Filed 1988·Granted May 29, 1990·50 cites·16 claims
- 1580US5966903AHigh speed flip-chip dispensingLUCENT TECHNOLOGIES INC·Filed 1998·Granted Oct 19, 1999·65 cites·3 claims
- 1679US5564617AMethod and apparatus for assembling multichip modulesLUCENT TECHNOLOGIES INC·Filed 1995·Granted Oct 15, 1996·51 cites·19 claims
- 1778US6680212B2Method of testing and constructing monolithic multi-chip modulesLUCENT TECHNOLOGIES INC·Filed 2001·Granted Jan 20, 2004·24 cites·14 claims
- 1876US6369444B1Packaging silicon on silicon multichip modulesAGERE SYST GUARDIAN CORP·Filed 1998·Granted Apr 9, 2002·47 cites·12 claims
- 1975US6160715ATranslator for recessed flip-chip packageLUCENT TECHNOLOGIES INC·Filed 1998·Granted Dec 12, 2000·39 cites·18 claims
- 2074US6077725AMethod for assembling multichip modulesLUCENT TECHNOLOGIES INC·Filed 1992·Granted Jun 20, 2000·42 cites·23 claims
- 2174US6020219AMethod of packaging fragile devices with a gel medium confined by a rim memberLUCENT TECHNOLOGIES INC·Filed 1997·Granted Feb 1, 2000·47 cites·5 claims
- 2273US4102661ACaustic ray use of the drawdown zone of an optical fiber preform to control the drawing of the fiberBELL TELEPHONE LABOR INC·Filed 1977·Granted Jul 25, 1978·18 cites·12 claims
- 2372US5382300ASolder paste mixtureAT & T CORP·Filed 1994·Granted Jan 17, 1995·33 cites·20 claims
- 2469US6205745B1High speed flip-chip dispensingLUCENT TECHNOLOGIES INC·Filed 1998·Granted Mar 27, 2001·39 cites·4 claims
- 2568US6370766B1Manufacture of printed circuit cardsLUCENT TECHNOLOGIES INC·Filed 1997·Granted Apr 16, 2002·30 cites·9 claims
- 2664US5307983AMethod of making an article comprising solder bump bondingAT & T BELL LAB·Filed 1993·Granted May 3, 1994·30 cites·8 claims
- 2763US6251705B1Low profile integrated circuit packagesAGERE SYSTEMS INC·Filed 1999·Granted Jun 26, 2001·27 cites·12 claims
- 2848US5778913ACleaning solder-bonded flip-chip assembliesLUCENT TECHNOLOGIES INC·Filed 1997·Granted Jul 14, 1998·13 cites·7 claims
- 2946US5505367AMethod for bumping silicon devicesAT & T CORP·Filed 1994·Granted Apr 9, 1996·12 cites·4 claims
- 3041US6282100B1Low cost ball grid array packageAGERE SYST GUARDIAN CORP·Filed 1999·Granted Aug 28, 2001·9 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →