Inventor · disambiguated record
Atsushi Kumata
Also filed as: KUMATA ATSUSHI
14 granted patents·250 citations·filing 1993–2008
94Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0187US7499340B2Semiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 2008·Granted Mar 3, 2009·8 cites·18 claims
- 0285US6515913B2Semiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 2001·Granted Feb 4, 2003·22 cites·5 claims
- 0384US6335884B1Semiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 2000·Granted Jan 1, 2002·22 cites·5 claims
- 0482US6212089B1Semiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 2000·Granted Apr 3, 2001·18 cites·5 claims
- 0581US7203101B2Semiconductor memory device and defect remedying method thereofHITACHI ULSI SYS CO LTD·Filed 2006·Granted Apr 10, 2007·5 cites·6 claims
- 0678US7345929B2Semiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 2007·Granted Mar 18, 2008·4 cites·10 claims
- 0776US5602771ASemiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 1993·Granted Feb 11, 1997·43 cites·11 claims
- 0876US5579256ASemiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 1995·Granted Nov 26, 1996·45 cites·6 claims
- 0974US6657901B2Semiconductor device formed in a rectangle region on a semiconductor substrate including a voltage generating circuitHITACHI LTD·Filed 2002·Granted Dec 2, 2003·11 cites·41 claims
- 1071US6898130B2Semiconductor memory device and defect remedying method thereofHITACHI VLSI ENG·Filed 2003·Granted May 24, 2005·9 cites·6 claims
- 1170US7016236B2Semiconductor memory device and defect remedying method thereofHITACHI ULSI SYS CO LTD·Filed 2005·Granted Mar 21, 2006·2 cites·10 claims
- 1269US6049500ASemiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 1998·Granted Apr 11, 2000·28 cites·10 claims
- 1360US6160744ASemiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 1999·Granted Dec 12, 2000·18 cites·45 claims
- 1453US5854508ASemiconductor memory device having zigzag bonding pad arrangementHITACHI LTD·Filed 1996·Granted Dec 29, 1998·15 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →