Inventor · disambiguated record
Jeongho Yang
Also filed as: YANG JEONGHO
2 granted patents·2 pending applications·0 citations·filing 2021–2025
28Inventor score
Files withKULICKE & SOFFA IND INC4
Top patents by PatentIndex Score
4 records- 0168US11935864B2Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methodsKULICKE & SOFFA IND INC·Filed 2022·Granted Mar 19, 2024·0 cites·11 claims
- 0263US2025277877A1Methods of testing a process window, and automatically optimizing a process, on a wire bonding systemKULICKE & SOFFA IND INC·Filed 2025·Application pending·0 cites
- 0362US11515285B2Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methodsKULICKE & SOFFA IND INC·Filed 2021·Granted Nov 29, 2022·0 cites·14 claims
- 0452US2023352443A1Methods of improving wire bonding operationsKULICKE & SOFFA IND INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →