Inventor · disambiguated record
Glenn G. Daves
Also filed as: DAVES GLENN G · DAVES GLENN GRAHAM
27 granted patents·1 pending application·851 citations·filing 1996–2015
97Inventor score
Top patents by PatentIndex Score
28 records- 0197US8916421B2Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduitsGONG ZHIWEI·Filed 2011·Granted Dec 23, 2014·65 cites·17 claims
- 0297US6444496B1Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereofIBM·Filed 2000·Granted Sep 3, 2002·123 cites·10 claims
- 0396US8327126B2Multicore processor and method of use that adapts core functions based on workload executionBELL JR ROBERT H·Filed 2008·Granted Dec 4, 2012·53 cites·15 claims
- 0493US9461009B1Method and apparatus for assembling a semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Oct 4, 2016·10 cites·20 claims
- 0593US7405247B2Conductive adhesive compositionIBM·Filed 2007·Granted Jul 29, 2008·26 cites·1 claims
- 0693US6292369B1Methods for customizing lid for improved thermal performance of modules using flip chipsIBM·Filed 2000·Granted Sep 18, 2001·82 cites·10 claims
- 0791US7268570B1Apparatus and method for customized burn-in of cores on a multicore microprocessor integrated circuit chipIBM·Filed 2006·Granted Sep 11, 2007·24 cites·20 claims
- 0891US6091603ACustomizable lid for improved thermal performance of modules using flip chipsIBM·Filed 1999·Granted Jul 18, 2000·122 cites·16 claims
- 0990US6275381B1Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereofIBM·Filed 1998·Granted Aug 14, 2001·65 cites·12 claims
- 1089US6878608B2Method of manufacture of silicon based packageIBM·Filed 2001·Granted Apr 12, 2005·54 cites·16 claims
- 1188US8597983B2Semiconductor device packaging having substrate with pre-encapsulation through via formationGONG ZHIWEI·Filed 2011·Granted Dec 3, 2013·10 cites·13 claims
- 1288US7393419B2Conductive adhesive rework methodIBM·Filed 2007·Granted Jul 1, 2008·14 cites·8 claims
- 1387US7079393B2Fluidic cooling systems and methods for electronic componentsIBM·Filed 2004·Granted Jul 18, 2006·44 cites·21 claims
- 1486US9142502B2Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduitsGONG ZHIWEI·Filed 2011·Granted Sep 22, 2015·9 cites·13 claims
- 1586US7420378B2Power grid structure to optimize performance of a multiple core processorIBM·Filed 2006·Granted Sep 2, 2008·12 cites·8 claims
- 1681US7312261B2Thermal interface adhesive and reworkIBM·Filed 2004·Granted Dec 25, 2007·24 cites·1 claims
- 1776US5838545AHigh performance, low cost multi-chip modle packageIBM·Filed 1996·Granted Nov 17, 1998·59 cites·3 claims
- 1872US9059144B2Method for forming die assembly with heat spreaderHIGGINS III LEO M·Filed 2012·Granted Jun 16, 2015·3 cites·20 claims
- 1970US7900809B2Solder interconnection array with optimal mechanical integrityIBM·Filed 2008·Granted Mar 8, 2011·3 cites·13 claims
- 2068US7667470B2Power grid structure to optimize performance of a multiple core processorIBM·Filed 2008·Granted Feb 23, 2010·3 cites·12 claims
- 2166US6762489B2Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modulesIBM·Filed 2001·Granted Jul 13, 2004·12 cites·14 claims
- 2264US7445141B2Solder interconnection array with optimal mechanical integrityIBM·Filed 2004·Granted Nov 4, 2008·8 cites·19 claims
- 2361US6541365B2Insulating interposer between two electronic components and process thereofIBM·Filed 2001·Granted Apr 1, 2003·8 cites·19 claims
- 2456US7239516B2Flexure plate for maintaining contact between a cooling plate/heat sink and a microchipIBM·Filed 2004·Granted Jul 3, 2007·7 cites·21 claims
- 2552US8645673B2Multicore processor and method of use that adapts core functions based on workload executionBELL JR ROBERT H·Filed 2012·Granted Feb 4, 2014·0 cites·14 claims
- 2650US6974722B2Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modulesIBM·Filed 2004·Granted Dec 13, 2005·4 cites·3 claims
- 2740US6365977B1Insulating interposer between two electronic components and process thereofIBM·Filed 1999·Granted Apr 2, 2002·7 cites·18 claims
- 2839US2013049218A1Semiconductor device packaging having pre-encapsulation through via formationGONG ZHIWEI·Filed 2011·Application pending·0 cites
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