Inventor · disambiguated record
Zhen Pan
Also filed as: PAN ZHEN · PAN ZHEN GANG
3 granted patents·18 pending applications·11 citations·filing 2006–2025
61Inventor score
Files withYANGTZE MEMORY TECH CO LTD11SHANGHAI RUINING BIOTECHNOLOGY CO LTD6CISCO TECH INC1GOOGLE LLC1HK APPLIED SCIENCE & TECH RES1
Top patents by PatentIndex Score
21 records- 0172US9858230B2Multi-host hot-plugging of multiple cardsCISCO TECH INC·Filed 2015·Granted Jan 2, 2018·3 cites·24 claims
- 0272US8031795B2Pre-processing systems and methods for MIMO antenna systemsHK APPLIED SCIENCE & TECH RES·Filed 2006·Granted Oct 4, 2011·8 cites·24 claims
- 0371US2025015015A1Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0466US12136599B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Nov 5, 2024·0 cites·18 claims
- 0563US2025367331A1Medical hydrogel containing ultrasonically-imageable bubble microspheres and preparation method thereofSHANGHAI REUNION MEDICAL CO LTD·Filed 2024·Application pending·0 cites
- 0657US2025372513A1Semiconductor structures and fabrication methods thereof, semiconductor devices and fabrication methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0756US2025312512A1Medical hydrogel having radiation protection functionSHANGHAI RUINING BIOTECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 0856US2025365954A1Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0954US2025329690A1Managing high bandwidth memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1054US2025281667A1Medical hydrogelSHANGHAI RUINING BIOTECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 1153US2025029954A1Semiconductor devices and manufacturing methods thereof, chip package structuresYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1253US2025300117A1Semiconductor package structures based on chip back wafer bondingYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1352US2025125310A1Semiconductor package structuresYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1451US2024355689A1Stacked layers with filling structuresYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1550US2024355694A1Memory, fabrication method thereof and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1648US2021213182A1Medical hydrogel having radiation protection functionSHANGHAI RUINING BIOTECHNOLOGY CO LTD·Filed 2019·Application pending·0 cites
- 1748US2025129218A1Hydrogel kit capable of being quickly dissolved as required and use method thereofSHANGHAI RUINING BIOTECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 1848US2024355736A1Semiconductor structures and fabrication method thereof, memory device and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1943US2021162092A1Medical hydrogelSHANGHAI RUINING BIOTECHNOLOGY CO LTD·Filed 2018·Application pending·0 cites
- 2040US2022299594A1Millimeter wave radar on flexible printed circuit boardGOOGLE LLC·Filed 2020·Application pending·0 cites
- 2137US2025134951A1Octreotide acetate sustained-release microsphere as well as preparation method therefor and use thereofSHANGHAI RUINING BIOTECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →