Inventor · disambiguated record
Dennis Bankmann
Also filed as: BANKMANN DENNIS
5 granted patents·3 pending applications·0 citations·filing 2011–2020
59Inventor score
Top patents by PatentIndex Score
8 records- 0164US12359015B2Low-viscosity, rapid curing laminating adhesive compositionHENKEL AG & CO KGAA·Filed 2019·Granted Jul 15, 2025·0 cites·20 claims
- 0264US12157789B2Polyester-free laminating adhesive compositionHENKEL AG & CO KGAA·Filed 2019·Granted Dec 3, 2024·0 cites·10 claims
- 0352US9340713B2Adhesives having adhesion promoters with sulphonamide groupsHENKEL AG & CO KGAA·Filed 2014·Granted May 17, 2016·0 cites·10 claims
- 0450US12012531B2Polyester polyol-based adhesives on the basis of furandicarboxylic acid obtained from renewable raw materialsHENKEL AG & CO KGAA·Filed 2020·Granted Jun 18, 2024·0 cites·15 claims
- 0540US2011297318A1Metal-to-polymer bonding using an adhesive based on epoxidesBARRIAU EMILIE·Filed 2011·Application pending·0 cites
- 0639US9790404B2Dry bonding acrylate adhesive layersHENKEL AG & CO KGAA·Filed 2014·Granted Oct 17, 2017·0 cites·16 claims
- 0739US2012156412A1Use of Low-Temperature Foamable Epoxide Resins in Hollow Chamber StructuresBANKMANN DENNIS·Filed 2012·Application pending·0 cites
- 0835US2017121578A1Polyurethane Laminating Adhesive Containing FillerHENKEL AG & CO KGAA·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →