Inventor · disambiguated record

Saat Shukri Bin Embong

Also filed as: BIN EMBONG SAAT SHUKRI

2 granted patents·9 citations·filing 2005–2012

51Inventor score

Technology areasH10W

Files withONG YOU YANG2

Top patents by PatentIndex Score

2 records

0174US8164182B2Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chipONG YOU YANG·Filed 2005·Granted Apr 24, 2012·9 cites·10 claims
0244US8415786B2Thermally enhanced semiconductor package systemONG YOU YANG·Filed 2012·Granted Apr 9, 2013·0 cites·5 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →