Inventor · disambiguated record
Suresh D. Kadakia
Also filed as: KADAKIA SURESH · KADAKIA SURESH D
11 granted patents·201 citations·filing 1991–2013
91Inventor score
Top patents by PatentIndex Score
11 records- 0191US7806341B2Structure for implementing secure multichip modules for encryption applicationsIBM·Filed 2009·Granted Oct 5, 2010·16 cites·26 claims
- 0291US7281667B2Method and structure for implementing secure multichip modules for encryption applicationsIBM·Filed 2005·Granted Oct 16, 2007·18 cites·4 claims
- 0387US6528735B1Substrate design of a chip using a generic substrate designIBM·Filed 2001·Granted Mar 4, 2003·41 cites·18 claims
- 0485US7472836B2Method and structure for implementing secure multichip modules for encryption applicationsIBM·Filed 2007·Granted Jan 6, 2009·11 cites·5 claims
- 0584US8445331B2Multichip electronic packages and methods of manufactureKADAKIA SURESH D·Filed 2012·Granted May 21, 2013·6 cites·17 claims
- 0678US6676784B2Process for the manufacture of multilayer ceramic substratesIBM·Filed 2001·Granted Jan 13, 2004·20 cites·13 claims
- 0769US8587114B2Multichip electronic packages and methods of manufactureKADAKIA SURESH D·Filed 2010·Granted Nov 19, 2013·2 cites·19 claims
- 0869US5831810AElectronic component package with decoupling capacitors completely within die receiving cavity of substrateIBM·Filed 1996·Granted Nov 3, 1998·41 cites·17 claims
- 0964US5243140ADirect distribution repair and engineering change systemIBM·Filed 1991·Granted Sep 7, 1993·33 cites·13 claims
- 1056US9087834B2Multichip electronic packages and methods of manufactureIBM·Filed 2013·Granted Jul 21, 2015·0 cites·11 claims
- 1145US6179951B1Method of protecting a non-planar feature using compressive pads and apparatus thereofIBM·Filed 1999·Granted Jan 30, 2001·13 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →