Inventor · disambiguated record
Kuo Lung Lei
Also filed as: LEI KUO LUNG
2 granted patents·2 pending applications·359 citations·filing 1998–2003
73Inventor score
Top patents by PatentIndex Score
4 records- 0196US6100107AMicrochannel-element assembly and preparation method thereofIND TECH RES INST·Filed 1998·Granted Aug 8, 2000·180 cites·5 claims
- 0292US7008867B2Method for forming copper bump antioxidation surfaceAPTOS CORP·Filed 2003·Granted Mar 7, 2006·179 cites·12 claims
- 0332US2004166662A1MEMS wafer level chip scale packageAPTOS CORP·Filed 2003·Application pending·0 cites
- 0432US2004256719A1MEMS micro-cap wafer level chip scale packageAPTOS CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →