Inventor · disambiguated record
Cheng-Hong Wei
Also filed as: Wei cheng-hong
11 granted patents·1 pending application·15 citations·filing 2018–2024
82Inventor score
Files withWINBOND ELECTRONICS CORP12
Top patents by PatentIndex Score
12 records- 0191US11778932B2Resistive random access memory and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted Oct 3, 2023·2 cites·10 claims
- 0291US10685883B1Method of wafer dicing and dieWINBOND ELECTRONICS CORP·Filed 2019·Granted Jun 16, 2020·9 cites·12 claims
- 0384US10515853B1Method of wafer dicingWINBOND ELECTRONICS CORP·Filed 2018·Granted Dec 24, 2019·4 cites·10 claims
- 0476US12193344B2Method for manufacturing resistive random access memoryWINBOND ELECTRONICS CORP·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 0568US11978768B2Manufacturing method of semiconductor structureWINBOND ELECTRONICS CORP·Filed 2023·Granted May 7, 2024·0 cites·14 claims
- 0666US11764274B2Memory device having contact plugs with narrower and wider portionsWINBOND ELECTRONICS CORP·Filed 2021·Granted Sep 19, 2023·0 cites·9 claims
- 0763US11721720B2Semiconductor structureWINBOND ELECTRONICS CORP·Filed 2021·Granted Aug 8, 2023·0 cites·7 claims
- 0858US12336175B2Memory device and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2022·Granted Jun 17, 2025·0 cites·18 claims
- 0957US11056564B2Method of manufacturing a memory deviceWINBOND ELECTRONICS CORP·Filed 2019·Granted Jul 6, 2021·0 cites·5 claims
- 1054US2025072081A1Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1146US12027422B2Semiconductor structures and methods for forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Jul 2, 2024·0 cites·16 claims
- 1244US10957594B2Manufacturing method of semiconductor chipWINBOND ELECTRONICS CORP·Filed 2018·Granted Mar 23, 2021·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →