Inventor · disambiguated record
Cheng-Lay Ang
Also filed as: ANG CHENG-LAY
3 granted patents·16 citations·filing 2016–2019
64Inventor score
Files withST MICROELECTRONICS PTE LTD3
Top patents by PatentIndex Score
3 records- 0189US9911890B2Optical sensor package including a cavity formed in an image sensor dieST MICROELECTRONICS PTE LTD·Filed 2016·Granted Mar 6, 2018·14 cites·24 claims
- 0281US10347786B2Optical sensor package including a cavity formed in an image sensor dieST MICROELECTRONICS PTE LTD·Filed 2018·Granted Jul 9, 2019·2 cites·20 claims
- 0368US10749067B2Optical sensor package including a cavity formed in an image sensor dieST MICROELECTRONICS PTE LTD·Filed 2019·Granted Aug 18, 2020·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →