Inventor · disambiguated record
Claus Waechter
Also filed as: WAECHTER CLAUS
9 granted patents·2 pending applications·16 citations·filing 2016–2022
81Inventor score
Files withINFINEON TECHNOLOGIES AG11
Top patents by PatentIndex Score
11 records- 0189US11195787B2Semiconductor device including an antennaINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 7, 2021·7 cites·12 claims
- 0288US10549985B2Semiconductor package with a through port for sensor applicationsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 4, 2020·4 cites·15 claims
- 0384US10899604B2Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 26, 2021·3 cites·10 claims
- 0482US10435292B2Method for producing a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 8, 2019·2 cites·21 claims
- 0567US11505450B2Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 22, 2022·0 cites·9 claims
- 0665US11040872B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 22, 2021·0 cites·17 claims
- 0763US2022148951A1Semiconductor device including an antennaINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 0854US2023197577A1Semiconductor Devices Including a Premolded Leadframe and a Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0951US11251146B2Semiconductor devices having a non-galvanic connectionINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 1048US11145563B2Semiconductor devices having cutouts in an encapsulation material and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2019·Granted Oct 12, 2021·0 cites·25 claims
- 1144US12368111B2Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methodsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jul 22, 2025·0 cites·20 claims
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