Inventor · disambiguated record
Hiroyuki Deai
Also filed as: DEAI HIROYUKI
5 granted patents·2 pending applications·8 citations·filing 2004–2019
68Inventor score
Top patents by PatentIndex Score
7 records- 0186US10381320B2Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmiumNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2015·Granted Aug 13, 2019·6 cites·18 claims
- 0266US8043929B2Semiconductor substrate and method for production thereofSILTRONIC AG·Filed 2008·Granted Oct 25, 2011·2 cites·20 claims
- 0356US12145852B2Silica spherical particles for semiconductor sealing materialNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2019·Granted Nov 19, 2024·0 cites·8 claims
- 0443US10950570B2Bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2015·Granted Mar 16, 2021·0 cites·8 claims
- 0541US2005139961A1Semiconductor substrate and method for production thereofSILTRONIC AG·Filed 2004·Application pending·0 cites
- 0635US10526722B2Method for manufacturing silicon carbide single crystalSHOWA DENKO KK·Filed 2016·Granted Jan 7, 2020·0 cites·3 claims
- 0733US2012032229A1Silicon Wafer And Production Method ThereofDEAI HIROYUKI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →