Inventor · disambiguated record
Wiwat Tanwongwan
Also filed as: TANWONGWAN WIWAT
5 granted patents·5 pending applications·1 citations·filing 2014–2020
62Inventor score
Files withNXP BV10
Top patents by PatentIndex Score
10 records- 0164US10847385B2Glob top encapsulation using molding tapeNXP BV·Filed 2018·Granted Nov 24, 2020·1 cites·15 claims
- 0254US11637024B2Method for glob top encapsulation using molding tape with elevated sidewallNXP BV·Filed 2020·Granted Apr 25, 2023·0 cites·11 claims
- 0345US11114239B2Electronic device, device package, and method of fabricationNXP BV·Filed 2019·Granted Sep 7, 2021·0 cites·18 claims
- 0441US9824980B2Lead finger locking structureNXP BV·Filed 2014·Granted Nov 21, 2017·0 cites·20 claims
- 0539US10763203B1Conductive trace design for smart cardNXP BV·Filed 2019·Granted Sep 1, 2020·0 cites·18 claims
- 0634US2017033034A1Electronic device and packageNXP BV·Filed 2016·Application pending·0 cites
- 0731US2019229044A1Lead frame with plated lead tipsNXP BV·Filed 2018·Application pending·0 cites
- 0831US2017133342A1Bond Wire ConnectionNXP BV·Filed 2016·Application pending·0 cites
- 0928US2018226353A1Semiconductor lead frame with machine readable markNXP BV·Filed 2017·Application pending·0 cites
- 1027US2017047275A1Reducing lead stress in micro-electronic packagesNXP BV·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →