Inventor · disambiguated record
Shinji Rokuhara
Also filed as: ROKUHARA SHINJI
12 granted patents·1 pending application·35 citations·filing 2010–2018
87Inventor score
Top patents by PatentIndex Score
13 records- 0185US10410884B2Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrateSONY CORP·Filed 2017·Granted Sep 10, 2019·4 cites·20 claims
- 0285US8254144B2Circuit board laminated module and electronic equipmentMATSUMOTO KATSUJI·Filed 2010·Granted Aug 28, 2012·14 cites·8 claims
- 0384US8482107B2Circular shield of a circuit-substrate laminated module and electronic apparatusROKUHARA SHINJI·Filed 2010·Granted Jul 9, 2013·10 cites·15 claims
- 0473US10109571B2Wiring substrate and manufacturing method of wiring substrateFUJITSU LTD·Filed 2016·Granted Oct 23, 2018·2 cites·10 claims
- 0570US9723724B2Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrateSONY CORP·Filed 2014·Granted Aug 1, 2017·2 cites·8 claims
- 0670US9648794B2Wiring board and electronic apparatusSONY CORP·Filed 2013·Granted May 9, 2017·2 cites·14 claims
- 0761US10634862B2Optical communication device, reception apparatus, transmission apparatus, and transmission and reception systemSONY CORP·Filed 2018·Granted Apr 28, 2020·0 cites·15 claims
- 0860US10483413B2Photoelectric module and optical deviceSONY CORP·Filed 2015·Granted Nov 19, 2019·1 cites·16 claims
- 0958US9614347B2Optical communication device, reception apparatus, transmission apparatus, and transmission and reception systemSONY CORP·Filed 2014·Granted Apr 4, 2017·0 cites·15 claims
- 1057US10168498B2Optical communication device, reception apparatus, transmission apparatus, and transmission and reception systemSONY CORP·Filed 2017·Granted Jan 1, 2019·0 cites·6 claims
- 1146US2013149464A1Method of manufacturing circuit boardSONY CORP·Filed 2012·Application pending·0 cites
- 1242US10593606B2Wiring board, and manufacturing methodSONY CORP·Filed 2016·Granted Mar 17, 2020·0 cites·14 claims
- 1338US8497567B2Thin-film capacitor, multilayer wiring board and semiconductor deviceROKUHARA SHINJI·Filed 2012·Granted Jul 30, 2013·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →