Inventor · disambiguated record
James Steven Kamperman
Also filed as: KAMPERMAN JAMES S · KAMPERMAN JAMES STEVEN
11 granted patents·1 pending application·351 citations·filing 1988–2007
93Inventor score
Top patents by PatentIndex Score
12 records- 0189US6156484AGray scale etching for thin flexible interposerIBM·Filed 1998·Granted Dec 5, 2000·78 cites·12 claims
- 0289US5949246ATest head for applying signals in a burn-in test of an integrated circuitIBM·Filed 1997·Granted Sep 7, 1999·65 cites·4 claims
- 0384US6094060ATest head for applying signals in a burn-in test of an integrated circuitIBM·Filed 1999·Granted Jul 25, 2000·44 cites·7 claims
- 0484US5734560ACap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the capIBM·Filed 1996·Granted Mar 31, 1998·54 cites·14 claims
- 0581US6094059AApparatus and method for burn-in/testing of integrated circuit devicesIBM·Filed 1999·Granted Jul 25, 2000·39 cites·2 claims
- 0657US4835847AMethod and apparatus for mounting a flexible film electronic device carrier on a substrateIBM·Filed 1988·Granted Jun 6, 1989·23 cites·13 claims
- 0752US6594891B1Process for forming multi-layer electronic structuresIBM·Filed 2000·Granted Jul 22, 2003·3 cites·7 claims
- 0849US2008296348A1Heater for select solder machineSLATER JR RICHARD F·Filed 2007·Application pending·0 cites
- 0947US5378307AFluid treatment apparatusIBM·Filed 1993·Granted Jan 3, 1995·21 cites·35 claims
- 1044US5773195ACap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the capIBM·Filed 1995·Granted Jun 30, 1998·9 cites·11 claims
- 1143US6098280AProcess for forming multi-layer electronic structures including a cap for providing a flat surface for DCA and solder ball attach and for sealing plated through holesIBM·Filed 1998·Granted Aug 8, 2000·8 cites·18 claims
- 1236US5363553AMethod of drilling vias and through holesIBM·Filed 1993·Granted Nov 15, 1994·7 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →