Inventor · disambiguated record
Hiroshige Ohkawa
Also filed as: OHKAWA HIROSHIGE
5 granted patents·4 pending applications·63 citations·filing 2000–2020
74Inventor score
Top patents by PatentIndex Score
9 records- 0190US6908960B2Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettinTDK CORP·Filed 2000·Granted Jun 21, 2005·58 cites·32 claims
- 0273US8303752B2Method of manufacturing wiring boardKAWABATA KENICHI·Filed 2009·Granted Nov 6, 2012·2 cites·4 claims
- 0355US6407020B1Ceramics compositionTDK CORP·Filed 2000·Granted Jun 18, 2002·3 cites·13 claims
- 0449US2005130447A1Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin compositionTDK CORP·Filed 2005·Application pending·0 cites
- 0549US2005130446A1Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin compositionTDK CORP·Filed 2005·Application pending·0 cites
- 0649US2005154110A1Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin compositionTDK CORP·Filed 2005·Application pending·0 cites
- 0746US9635756B2Circuit board incorporating semiconductor IC and manufacturing method thereofTDK CORP·Filed 2013·Granted Apr 25, 2017·0 cites·20 claims
- 0843US2009025961A1Electronic component-embedded board and method of manufacturing the sameTDK CORP·Filed 2008·Application pending·0 cites
- 0941US12243841B2Electronic component embedded substrate and circuit module using the sameTDK CORP·Filed 2020·Granted Mar 4, 2025·0 cites·20 claims
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