Inventor · disambiguated record
Seong-Ii Han
Also filed as: HAN SEONG-II
1 granted patent·2 pending applications·23 citations·filing 2005–2008
41Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0187US7459774B2Stacked chip package using photosensitive polymer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 2, 2008·23 cites·13 claims
- 0246US2008318363A1Stack circuit member and methodKWON YONG-CHAI·Filed 2008·Application pending·0 cites
- 0342US2006278991A1Stack circuit member and methodKWON YONG-CHAI·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Seong-Ii Han files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →