Inventor · disambiguated record
Wei-Chung Wang
Also filed as: WANG WEI · WANG WEI C · WANG WEI-CHUNG · WANG WEI-CHUNG JONES
143 granted patents·39 pending applications·947 citations·filing 1986–2025
99Inventor score
Files withPIXART IMAGING INC25AMAZON TECH INC19CHINA WAFER LEVEL CSP CO LTD16ADVANCED SEMICONDUCTOR ENG14VOLVO CAR CORP10
Top patents by PatentIndex Score
182 records- 0197US8158888B2Circuit substrate and method of fabricating the same and chip package structureSHEN CHI-CHIH·Filed 2009·Granted Apr 17, 2012·81 cites·27 claims
- 0296US10013388B1Dynamic peer-to-peer configurationAMAZON TECH INC·Filed 2016·Granted Jul 3, 2018·29 cites·25 claims
- 0395US7741152B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 22, 2010·44 cites·11 claims
- 0495US7385175B2Bi-directional optical transmission system and methodLI CHIAN CHIU·Filed 2005·Granted Jun 10, 2008·32 cites·20 claims
- 0594US9761744B2System and method for manufacturing photovoltaic structures with a metal seed layerSOLARCITY CORP·Filed 2015·Granted Sep 12, 2017·11 cites·20 claims
- 0694US7706149B2Micro-electro-mechanical-system package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Apr 27, 2010·38 cites·14 claims
- 0794US7528053B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted May 5, 2009·31 cites·22 claims
- 0893US12134403B2Vehicle, driving assistance device and methodVOLVO CAR CORP·Filed 2022·Granted Nov 5, 2024·2 cites·15 claims
- 0993US7811858B2Package and the method for making the same, and a stacked packageADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Oct 12, 2010·24 cites·11 claims
- 1093US7642132B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 5, 2010·24 cites·20 claims
- 1193US7394152B2Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the sameCHINA WAFER LEVEL CSP LTD·Filed 2006·Granted Jul 1, 2008·47 cites·5 claims
- 1292US12106473B2Medical image analyzing system for identifying pancreatic cancer using machine learning and method thereofUNIV NAT TAIWAN·Filed 2021·Granted Oct 1, 2024·5 cites·28 claims
- 1392US11858143B1System for identifying a user with an autonomous mobile deviceAMAZON TECH INC·Filed 2020·Granted Jan 2, 2024·5 cites·20 claims
- 1492USD942881SMotion sensorAMAZON TECH INC·Filed 2019·Granted Feb 8, 2022·27 cites·1 claims
- 1591USD962101SMotion sensorAMAZON TECH INC·Filed 2020·Granted Aug 30, 2022·14 cites·1 claims
- 1691USD928759SRange extender deviceAMAZON TECH INC·Filed 2019·Granted Aug 24, 2021·23 cites·1 claims
- 1791US7781250B2Wafer level chip size package for MEMS devices and method for fabricating the sameCHINA WAFER LEVEL CSP LTD·Filed 2008·Granted Aug 24, 2010·27 cites·10 claims
- 1890US12099366B2System for obstacle detectionPIXART IMAGING INC·Filed 2023·Granted Sep 24, 2024·1 cites·11 claims
- 1990USD1019433SMotion sensorAMAZON TECH INC·Filed 2022·Granted Mar 26, 2024·10 cites·1 claims
- 2090US11669103B2System for obstacle detectionPIXART IMAGING INC·Filed 2021·Granted Jun 6, 2023·2 cites·11 claims
- 2190US7446404B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Nov 4, 2008·18 cites·8 claims
- 2289US7336259B2Rechargeable wireless input deviceKYE SYSTEMS CORP·Filed 2005·Granted Feb 26, 2008·29 cites·17 claims
- 2388US11353993B2Optical detection devicePIXART IMAGING INC·Filed 2020·Granted Jun 7, 2022·2 cites·14 claims
- 2487USD987634SKeypadAMAZON TECH INC·Filed 2022·Granted May 30, 2023·7 cites·1 claims
- 2587US11473253B2Concrete deck demolition system and methodWANG WEI·Filed 2020·Granted Oct 18, 2022·2 cites·2 claims
- 2687USD956047SKeypadAMAZON TECH INC·Filed 2021·Granted Jun 28, 2022·8 cites·1 claims
- 2787USD806669SHandsetMICROSOFT CORP·Filed 2015·Granted Jan 2, 2018·43 cites·1 claims
- 2887US7663213B2Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the sameCHINA WAFER LEVEL CSP LTD·Filed 2006·Granted Feb 16, 2010·20 cites·7 claims
- 2985US11829180B2Pressure detection devicePIXART IMAGING INC·Filed 2021·Granted Nov 28, 2023·1 cites·7 claims
- 3085US11607994B2Vehicle, object warning apparatus and methodVOLVO CAR CORP·Filed 2021·Granted Mar 21, 2023·1 cites·14 claims
- 3185US9362765B1Systems and methods for a power adapter for mobile devicesAMAZON TECH INC·Filed 2013·Granted Jun 7, 2016·18 cites·18 claims
- 3285US6383846B1Method and apparatus for molding a flip chip semiconductor deviceFiled 2000·Granted May 7, 2002·42 cites·4 claims
- 3384US12360537B2Robot capable of identifying tunnelsPIXART IMAGING INC·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 3484USD970487SRange extender deviceAMAZON TECH INC·Filed 2021·Granted Nov 22, 2022·6 cites·1 claims
- 3584US10133907B2Fingerprint recognition chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Nov 20, 2018·5 cites·20 claims
- 3684US8803943B2Formation apparatus using digital image correlationHUANG CHI-HUNG·Filed 2011·Granted Aug 12, 2014·7 cites·28 claims
- 3783USD1005999SRange extender deviceAMAZON TECH INC·Filed 2022·Granted Nov 28, 2023·5 cites·1 claims
- 3882USD923625SKeypadAMAZON TECH INC·Filed 2019·Granted Jun 29, 2021·13 cites·1 claims
- 3982US11009882B2Method, system for obstacle detection and a sensor subsystemPIXART IMAGING INC·Filed 2018·Granted May 18, 2021·4 cites·11 claims
- 4082US8645354B2Scalable metadata extraction for video searchKONG XIAO·Filed 2011·Granted Feb 4, 2014·8 cites·18 claims
- 4181US11787396B2Automatic parking assistance system, in-vehicle device and methodVOLVO CAR CORP·Filed 2021·Granted Oct 17, 2023·1 cites·14 claims
- 4280USD1024806SContact sensorAMAZON TECH INC·Filed 2022·Granted Apr 30, 2024·5 cites·1 claims
- 4380US11777590B2Message set and a messaging method for vehicular communicationVOLVO CAR CORP·Filed 2021·Granted Oct 3, 2023·1 cites·17 claims
- 4479US11994871B2Moving robot without detection dead zonePIXART IMAGING INC·Filed 2023·Granted May 28, 2024·0 cites·18 claims
- 4579USD1015180SMotion sensorAMAZON TECH INC·Filed 2022·Granted Feb 20, 2024·4 cites·1 claims
- 4678US8288853B2Three-dimensional package and method of making the sameHUANG MIN-LUNG·Filed 2009·Granted Oct 16, 2012·9 cites·10 claims
- 4776US11675365B2Moving robot without detection dead zonePIXART IMAGING INC·Filed 2022·Granted Jun 13, 2023·0 cites·20 claims
- 4876US10276540B2Chip packaging method and chip packaging structureCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Apr 30, 2019·3 cites·17 claims
- 4976US9762897B2Conic section calibration object for calibrating image capturing deviceNAT APPLIED RES LABORATORIES·Filed 2015·Granted Sep 12, 2017·2 cites·12 claims
- 5075US11353884B2Robot without detection dead zonePIXART IMAGING INC·Filed 2019·Granted Jun 7, 2022·1 cites·19 claims
Showing the top 50 of 182 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →