Inventor · disambiguated record
Chin-Fu Lin
Also filed as: LIN CHIN-FU
84 granted patents·26 pending applications·357 citations·filing 1996–2022
99Inventor score
Top patents by PatentIndex Score
110 records- 0196US8441072B2Non-planar semiconductor structure and fabrication method thereofTSAI SHIH-HUNG·Filed 2011·Granted May 14, 2013·27 cites·19 claims
- 0294US9048254B2Semiconductor structure having a metal gate with side wall spacersCHEN YI-WEI·Filed 2009·Granted Jun 2, 2015·22 cites·9 claims
- 0394US8669618B2Manufacturing method for semiconductor device having metal gateFU SSU-I·Filed 2011·Granted Mar 11, 2014·20 cites·7 claims
- 0492US8836049B2Semiconductor structure and process thereofTSAI MIN-CHUAN·Filed 2012·Granted Sep 16, 2014·29 cites·12 claims
- 0592US8481343B2Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the sameHSIN CHUNG-HSIEN·Filed 2010·Granted Jul 9, 2013·20 cites·7 claims
- 0690US11545521B2Magnetic tunnel junction (MTJ) device and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 3, 2023·2 cites·16 claims
- 0790US10121827B1Semiconductor structure and the method of making the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Nov 6, 2018·7 cites·20 claims
- 0890US9263257B2Semiconductor device having fin-shaped structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Feb 16, 2016·8 cites·9 claims
- 0990US9166020B2Metal gate structure and manufacturing method thereofYANG CHAN-LON·Filed 2011·Granted Oct 20, 2015·11 cites·8 claims
- 1089US8551829B2Method for manufacturing multi-gate transistor deviceCHIEN CHIN-CHENG·Filed 2010·Granted Oct 8, 2013·11 cites·18 claims
- 1189US8324118B2Manufacturing method of metal gate structureLIU CHIH-CHIEN·Filed 2011·Granted Dec 4, 2012·11 cites·10 claims
- 1288US8951884B1Method for forming a FinFET structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Feb 10, 2015·7 cites·11 claims
- 1387US9018086B2Semiconductor device having a metal gate and fabricating method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 28, 2015·7 cites·5 claims
- 1486US10756128B2Integrated circuit device and method of fabricating integrated circuitUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 25, 2020·5 cites·20 claims
- 1585US8735269B1Method for forming semiconductor structure having TiN layerUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 27, 2014·7 cites·14 claims
- 1685US8609529B2Fabrication method and structure of through silicon viaLIN CHIN-FU·Filed 2012·Granted Dec 17, 2013·7 cites·12 claims
- 1785US8497198B2Semiconductor processCHIEN CHIN-CHENG·Filed 2011·Granted Jul 30, 2013·8 cites·18 claims
- 1883US9397189B2Semiconductor structure having a metal gate with side wall spacersUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jul 19, 2016·3 cites·14 claims
- 1982US9263282B2Method of fabricating semiconductor patternsUNITED MICROELECTRONICS CORP·Filed 2013·Granted Feb 16, 2016·5 cites·13 claims
- 2082US9184100B2Semiconductor device having strained fin structure and method of making the sameTSAI TENG-CHUN·Filed 2011·Granted Nov 10, 2015·6 cites·9 claims
- 2181US8822284B2Method for fabricating FinFETs and semiconductor structure fabricated using the methodLIN CHIN-FU·Filed 2012·Granted Sep 2, 2014·4 cites·13 claims
- 2280US9159831B2Multigate field effect transistor and process thereofUNITED MICROELECTRONICS CORP·Filed 2012·Granted Oct 13, 2015·4 cites·7 claims
- 2379US8441086B2Image sensor packaging structure with predetermined focal lengthTU HSIU-WEN·Filed 2010·Granted May 14, 2013·6 cites·4 claims
- 2479US8390087B2Image sensor package structure with large air cavityTU HSIU-WEN·Filed 2010·Granted Mar 5, 2013·7 cites·13 claims
- 2578US11950431B2Magnetic tunnel junction (MTJ) device and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 2, 2024·0 cites·20 claims
- 2677US8691681B2Semiconductor device having a metal gate and fabricating method thereofHSU CHI-MAO·Filed 2012·Granted Apr 8, 2014·4 cites·13 claims
- 2776US8361854B2Fin field-effect transistor structure and manufacturing process thereofUNITED MICROELECTRONICS CORP·Filed 2011·Granted Jan 29, 2013·3 cites·12 claims
- 2875US9559189B2Non-planar FETCHIEN CHIN-CHENG·Filed 2012·Granted Jan 31, 2017·3 cites·7 claims
- 2975US9184292B2Semiconductor structure with different fins of FinFETsUNITED MICROELECTRONICS CORP·Filed 2014·Granted Nov 10, 2015·2 cites·20 claims
- 3075US8860150B2Metal gate structureLIN CHIN-FU·Filed 2009·Granted Oct 14, 2014·6 cites·9 claims
- 3175US8815703B2Fabricating method of shallow trench isolation structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Aug 26, 2014·4 cites·6 claims
- 3274US8860135B2Semiconductor structure having aluminum layer with high reflectivityHSU CHI-MAO·Filed 2012·Granted Oct 14, 2014·3 cites·5 claims
- 3374US8420544B2Method for fabricating interconnection structure with dry-cleaning processHUANG HSIN-FU·Filed 2010·Granted Apr 16, 2013·3 cites·16 claims
- 3473US8928104B2Image sensor packaging structure with black encapsulantTU HSIU-WEN·Filed 2010·Granted Jan 6, 2015·4 cites·12 claims
- 3573US8067806B2Gate structures of CMOS device and method for manufacturing the sameLIN CHUN-HSIEN·Filed 2009·Granted Nov 29, 2011·5 cites·4 claims
- 3671US11476367B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 18, 2022·0 cites·8 claims
- 3771US8822336B2Through-silicon via forming methodTSAI TENG-CHUN·Filed 2011·Granted Sep 2, 2014·3 cites·8 claims
- 3871US5778386AGlobal view storage management system for semiconductor manufacturing plantsTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Jul 7, 1998·49 cites·20 claims
- 3970US8093674B2Manufacturing method for molding image sensor package structure and image sensor package structure thereofTU HSIU-WEN·Filed 2009·Granted Jan 10, 2012·5 cites·11 claims
- 4068US9966425B1Method for fabricating a MIM capacitorUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 8, 2018·1 cites·14 claims
- 4167US11450747B2Semiconductor structure with an epitaxial layerUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 20, 2022·0 cites·9 claims
- 4267US9318567B2Fabrication method for semiconductor devicesCHIEN CHIN-CHENG·Filed 2012·Granted Apr 19, 2016·2 cites·20 claims
- 4367US8847146B2Image sensor package structure with casing including a vent without sealing and in communication with package materialTU HSIU-WEN·Filed 2009·Granted Sep 30, 2014·4 cites·7 claims
- 4466US11424408B2ReRAM structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 23, 2022·0 cites·7 claims
- 4565US9018087B2Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 28, 2015·1 cites·17 claims
- 4664US8779513B2Non-planar semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jul 15, 2014·1 cites·6 claims
- 4763US9024393B2Manufacturing method for semiconductor device having metal gateUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 5, 2015·1 cites·20 claims
- 4862US8647941B2Method of forming semiconductor deviceCHIEN CHIN-CHENG·Filed 2011·Granted Feb 11, 2014·1 cites·15 claims
- 4962US8647989B2Method of forming opening on semiconductor substrateWU CHUN-YUAN·Filed 2011·Granted Feb 11, 2014·1 cites·7 claims
- 5062US8034690B2Method of etching oxide layer and nitride layerUNITED MICROELECTRONICS CORP·Filed 2010·Granted Oct 11, 2011·1 cites·9 claims
Showing the top 50 of 110 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →