Inventor · disambiguated record
Hsiao-Chuan Chang
Also filed as: CHANG HSIAO-CHUAN
16 granted patents·7 pending applications·107 citations·filing 1995–2013
91Inventor score
Files withADVANCED SEMICONDUCTOR ENG7CHANG HSIAO-CHUAN5LAI YI-SHAO4WAY TUN-FUN2CHANG CHIEN PAO-HUEI1
Top patents by PatentIndex Score
23 records- 0192US8053906B2Semiconductor package and method for processing and bonding a wireADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Nov 8, 2011·32 cites·19 claims
- 0290US8115285B2Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereofCHEN CHIEN-WEN·Filed 2008·Granted Feb 14, 2012·22 cites·27 claims
- 0389US8274149B2Semiconductor device package having a buffer structure and method of fabricating the sameCHANG HSIAO-CHUAN·Filed 2010·Granted Sep 25, 2012·14 cites·14 claims
- 0483US8072064B1Semiconductor package and method for making the sameLAI YI-SHAO·Filed 2010·Granted Dec 6, 2011·9 cites·21 claims
- 0577US7980757B2Bonding strength measuring deviceADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Jul 19, 2011·5 cites·6 claims
- 0672US9618191B2Light emitting package and LED bulbADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Apr 11, 2017·2 cites·33 claims
- 0766US7964949B2Tenon-and-mortise packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jun 21, 2011·4 cites·12 claims
- 0862US8421242B2Semiconductor packageCHANG HSIAO-CHUAN·Filed 2009·Granted Apr 16, 2013·2 cites·6 claims
- 0960US8368216B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Feb 5, 2013·1 cites·20 claims
- 1058US8865106B2Composite raw material, carbon fiber material and method for forming the sameWAY TUN-FUN·Filed 2012·Granted Oct 21, 2014·0 cites·13 claims
- 1155US8110931B2Wafer and semiconductor packageCHANG HSIAO CHUAN·Filed 2009·Granted Feb 7, 2012·1 cites·21 claims
- 1254US5643518AProcess for preparing fibers of soluble wholly aromatic polyamidesIND TECH RES INST·Filed 1995·Granted Jul 1, 1997·14 cites·13 claims
- 1350US8076786B2Semiconductor package and method for packaging a semiconductor packageHUNG CHANG YING·Filed 2009·Granted Dec 13, 2011·1 cites·20 claims
- 1448US8018075B2Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Sep 13, 2011·0 cites·20 claims
- 1546US2009051048A1Package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 1640US2011156739A1Test kit for testing a chip subassembly and a testing method by using the sameCHANG HSIAO-CHUAN·Filed 2009·Application pending·0 cites
- 1738US8222726B2Semiconductor device package having a jumper chip and method of fabricating the sameCHANG HSIAO-CHUAN·Filed 2010·Granted Jul 17, 2012·0 cites·16 claims
- 1835US2012091575A1Semiconductor Package And Method For Making The SameLAI YI-SHAO·Filed 2010·Application pending·0 cites
- 1935US2012119342A1Advanced quad flat non-leaded package structure and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2010·Application pending·0 cites
- 2035US2012139143A1Plasticizing agent, composition for polyacrylonitrile-based precursor and fabrication method of carbon fiberWAY TUN-FUN·Filed 2011·Application pending·0 cites
- 2135US2011298139A1Semiconductor PackageLAI YI-SHAO·Filed 2010·Application pending·0 cites
- 2235US2011278739A1Semiconductor PackageLAI YI-SHAO·Filed 2010·Application pending·0 cites
- 2333US8222733B2Semiconductor device packageCHENG MING-HSIANG·Filed 2010·Granted Jul 17, 2012·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →