Inventor · disambiguated record
Yi-Shao Lai
Also filed as: LAI YI-SHAO
22 granted patents·12 pending applications·115 citations·filing 2005–2017
94Inventor score
Files withADVANCED SEMICONDUCTOR ENG16LAI YI-SHAO7CHANG HSIAO-CHUAN5ADVANCE SEMICONDUCTOR ENGINEER1CHANG CHIEN PAO-HUEI1
Top patents by PatentIndex Score
34 records- 0192US8053906B2Semiconductor package and method for processing and bonding a wireADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Nov 8, 2011·32 cites·19 claims
- 0290US8115285B2Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereofCHEN CHIEN-WEN·Filed 2008·Granted Feb 14, 2012·22 cites·27 claims
- 0389US8274149B2Semiconductor device package having a buffer structure and method of fabricating the sameCHANG HSIAO-CHUAN·Filed 2010·Granted Sep 25, 2012·14 cites·14 claims
- 0487US7329900B2Bonding strength testing deviceADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Feb 12, 2008·12 cites·14 claims
- 0583US8072064B1Semiconductor package and method for making the sameLAI YI-SHAO·Filed 2010·Granted Dec 6, 2011·9 cites·21 claims
- 0680US9589840B2Semiconductor package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Mar 7, 2017·4 cites·18 claims
- 0777US7980757B2Bonding strength measuring deviceADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Jul 19, 2011·5 cites·6 claims
- 0871US7482204B2Chip packaging processADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jan 27, 2009·4 cites·8 claims
- 0966US7964949B2Tenon-and-mortise packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jun 21, 2011·4 cites·12 claims
- 1062US8421242B2Semiconductor packageCHANG HSIAO-CHUAN·Filed 2009·Granted Apr 16, 2013·2 cites·6 claims
- 1162US7335982B2Chip package structure and chip packaging processADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Feb 26, 2008·2 cites·13 claims
- 1260US8368216B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Feb 5, 2013·1 cites·20 claims
- 1358US7955897B2Chip structure and stacked chip package as well as method for manufacturing chip structuresADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jun 7, 2011·1 cites·5 claims
- 1455US8110931B2Wafer and semiconductor packageCHANG HSIAO CHUAN·Filed 2009·Granted Feb 7, 2012·1 cites·21 claims
- 1555US7444884B2Tensile test methodADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Nov 4, 2008·0 cites·1 claims
- 1652US10056325B2Semiconductor package having a trench penetrating a main bodyADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Aug 21, 2018·0 cites·18 claims
- 1752US8253431B2Apparatus and method for testing non-contact pads of a semiconductor device to be testedLAI YI-SHAO·Filed 2010·Granted Aug 28, 2012·1 cites·10 claims
- 1850US8076786B2Semiconductor package and method for packaging a semiconductor packageHUNG CHANG YING·Filed 2009·Granted Dec 13, 2011·1 cites·20 claims
- 1949US2006117865A1Tensile test fixture and tensile test methodLAI YI-SHAO·Filed 2005·Application pending·0 cites
- 2048US8018075B2Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Sep 13, 2011·0 cites·20 claims
- 2146US2009051031A1Package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 2246US2009051048A1Package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 2343US2007284756A1Stacked chip packageADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 2442US2007145604A1Chip structure and chip manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 2540US2011156739A1Test kit for testing a chip subassembly and a testing method by using the sameCHANG HSIAO-CHUAN·Filed 2009·Application pending·0 cites
- 2640US2005224936A1Chip package structureWU JENG-DAH·Filed 2005·Application pending·0 cites
- 2739US8592982B2Semiconductor package having proximity communication signal input terminals and manufacturing methods thereofLAI YI-SHAO·Filed 2011·Granted Nov 26, 2013·0 cites·20 claims
- 2838US8222726B2Semiconductor device package having a jumper chip and method of fabricating the sameCHANG HSIAO-CHUAN·Filed 2010·Granted Jul 17, 2012·0 cites·16 claims
- 2938US2005263883A1Asymmetric bump structureADVANCE SEMICONDUCTOR ENGINEER·Filed 2005·Application pending·0 cites
- 3035US2012091575A1Semiconductor Package And Method For Making The SameLAI YI-SHAO·Filed 2010·Application pending·0 cites
- 3135US2012119342A1Advanced quad flat non-leaded package structure and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2010·Application pending·0 cites
- 3235US2011298139A1Semiconductor PackageLAI YI-SHAO·Filed 2010·Application pending·0 cites
- 3335US2011278739A1Semiconductor PackageLAI YI-SHAO·Filed 2010·Application pending·0 cites
- 3433US8222733B2Semiconductor device packageCHENG MING-HSIANG·Filed 2010·Granted Jul 17, 2012·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →