Inventor · disambiguated record
Tetsuo Motomiya
Also filed as: MOTOMIYA TETSUO
8 granted patents·1 pending application·509 citations·filing 1982–2022
81Inventor score
Top patents by PatentIndex Score
9 records- 0195US4438931AGolf club headENDO SEISAKUSHO KK·Filed 1982·Granted Mar 27, 1984·505 cites·10 claims
- 0270US11972991B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Apr 30, 2024·2 cites·20 claims
- 0363US10536090B2Bus bar structure and power conversion device using sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jan 14, 2020·1 cites·14 claims
- 0459US10186607B2Power semiconductor device including a semiconductor switching elementMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jan 22, 2019·1 cites·8 claims
- 0551US11569141B2Semiconductor device including a groove within a resin insulating part positioned between and covering parts of a first electrode and a second electrodeMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 31, 2023·0 cites·22 claims
- 0651US2025157977A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0750US12308305B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted May 20, 2025·0 cites·13 claims
- 0847US12051671B2Pressure-contact-type semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jul 30, 2024·0 cites·5 claims
- 0939US10418347B2Power semiconductor device and power semiconductor core moduleMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 17, 2019·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Tetsuo Motomiya files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →