Inventor · disambiguated record
Shinji Nishihara
Also filed as: NISHIHARA SHINJI
42 granted patents·13 pending applications·546 citations·filing 1992–2018
98Inventor score
Top patents by PatentIndex Score
55 records- 0194US8724978B2Fluid heating-cooling cylinder deviceFURUMURA YUJI·Filed 2012·Granted May 13, 2014·15 cites·20 claims
- 0292US8237622B2Base sheetFURUMURA YUJI·Filed 2007·Granted Aug 7, 2012·26 cites·4 claims
- 0386US5904556AMethod for making semiconductor integrated circuit device having interconnection structure using tungsten filmHITACHI LTD·Filed 1996·Granted May 18, 1999·63 cites·15 claims
- 0484US10871700B2Drive apparatus, drive method, and optical deviceNIKON CORP·Filed 2018·Granted Dec 22, 2020·2 cites·8 claims
- 0584US5444012AMethod for manufacturing semiconductor integrated circuit device having a fuse elementHITACHI LTD·Filed 1994·Granted Aug 22, 1995·84 cites·12 claims
- 0683US8933784B2RF powder particle, RF powder, and RF powder-containing baseFURUMURA YUJI·Filed 2007·Granted Jan 13, 2015·11 cites·20 claims
- 0783US6656828B1Method of forming bump electrodesHITACHI LTD·Filed 1999·Granted Dec 2, 2003·102 cites·4 claims
- 0882US8766853B2Method for adding RF powder and RF powder-added base sheetFURUMURA YUJI·Filed 2007·Granted Jul 1, 2014·12 cites·21 claims
- 0979US8178415B2Method for manufacturing RF powderFURUMURA YUJI·Filed 2007·Granted May 15, 2012·10 cites·14 claims
- 1077US6780757B2Semiconductor integrated circuit device and method for making the sameRENESAS TECH CORP·Filed 2003·Granted Aug 24, 2004·17 cites·6 claims
- 1174US6031288ASemiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer and method of fabrication thereofHITACHI LTD·Filed 1996·Granted Feb 29, 2000·36 cites·49 claims
- 1273US6583049B2Semiconductor integrated circuit device and method for making the sameHITACHI LTD·Filed 2001·Granted Jun 24, 2003·13 cites·7 claims
- 1373US6503803B2Method of fabricating a semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layerHITACHI LTD·Filed 2001·Granted Jan 7, 2003·16 cites·32 claims
- 1471US8766802B2Base data management systemFURUMURA YUJI·Filed 2007·Granted Jul 1, 2014·2 cites·14 claims
- 1571US7553766B2Method of fabricating semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2007·Granted Jun 30, 2009·2 cites·9 claims
- 1671US7314830B2Method of fabricating semiconductor integrated circuit device with 99.99 wt% cobaltRENESAS TECH CORP·Filed 2007·Granted Jan 1, 2008·2 cites·10 claims
- 1769US6472754B2Semiconductor device with improved arrangements to avoid breakage of tungsten interconnectorHITACHI LTD·Filed 2001·Granted Oct 29, 2002·13 cites·9 claims
- 1868US9709340B2Fluid heat exchanging apparatusPHILTECH INC·Filed 2014·Granted Jul 18, 2017·1 cites·11 claims
- 1965US5188975AMethod of producing a connection hole for a DRAM having at least three conductor layers in a self alignment manner.HITACHI LTD·Filed 1992·Granted Feb 23, 1993·38 cites·15 claims
- 2064US6268658B1Semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer and method of fabrication thereofHITACHI LTD·Filed 2000·Granted Jul 31, 2001·10 cites·7 claims
- 2163US8318047B2Method for providing RF powder and RF powder-containing liquidFURUMURA YUJI·Filed 2007·Granted Nov 27, 2012·4 cites·17 claims
- 2263US2018164658A1Drive apparatus, drive method, and optical deviceNIKON CORP·Filed 2017·Application pending·0 cites
- 2362US6858484B2Method of fabricating semiconductor integrated circuit deviceHITACHI LTD·Filed 2003·Granted Feb 22, 2005·5 cites·9 claims
- 2460US9869921B2Drive apparatus, drive method, and optical deviceNIPPON KOGAKU KK·Filed 2016·Granted Jan 16, 2018·0 cites·5 claims
- 2560US8034715B2Method of fabricating semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Oct 11, 2011·0 cites·14 claims
- 2660US2018223431A1Film-forming methodPHILTECH INC·Filed 2018·Application pending·0 cites
- 2759US7064437B2Semiconductor device having aluminum conductorsHITACHI LTD·Filed 2002·Granted Jun 20, 2006·5 cites·10 claims
- 2859US6856021B1Semiconductor device having aluminum alloy conductorsRENESAS TECH CORP·Filed 2000·Granted Feb 15, 2005·5 cites·25 claims
- 2956US9915483B2Fluid heat exchanging apparatusPHILTECH INC·Filed 2014·Granted Mar 13, 2018·0 cites·12 claims
- 3056US6476492B2Semiconductor device having a capacitor and an interconnect layer with molybdenum-containing tungstenHITACHI LTD·Filed 2001·Granted Nov 5, 2002·5 cites·9 claims
- 3155US9366940B2Drive apparatus, drive method, and optical deviceNIKON CORP·Filed 2013·Granted Jun 14, 2016·0 cites·5 claims
- 3255US2017152599A1Film-forming apparatusPHILTECH INC·Filed 2016·Application pending·0 cites
- 3354US6548904B2Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenumHITACHI LTD·Filed 2002·Granted Apr 15, 2003·4 cites·8 claims
- 3454US2017275162A1Method of operating gas generating apparatusPHILTECH INC·Filed 2017·Application pending·0 cites
- 3554US2015083381A1Bonded fluid heat exchanging apparatusPHILTECH INC·Filed 2014·Application pending·0 cites
- 3652US9340736B2Solid gasification apparatusPHILTECH INC·Filed 2015·Granted May 17, 2016·0 cites·5 claims
- 3752US6617691B2Semiconductor deviceHITACHI LTD·Filed 2002·Granted Sep 9, 2003·4 cites·6 claims
- 3852US2016107891A1Gas Generating ApparatusPHILTECH INC·Filed 2015·Application pending·0 cites
- 3951US6693001B2Process for producing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 1997·Granted Feb 17, 2004·17 cites·13 claims
- 4050US6326216B1Process for producing semiconductor integrated circuit deviceHITACHI LTD·Filed 1997·Granted Dec 4, 2001·13 cites·55 claims
- 4149US8704202B2RF powder particles including an inductance element, a capacitance element, and a photovoltaic cell and method for exciting RF powderFURUMURA YUJI·Filed 2007·Granted Apr 22, 2014·0 cites·28 claims
- 4247US2009198878A1Information processing system and information processing methodNISHIHARA SHINJI·Filed 2009·Application pending·0 cites
- 4346US7214577B2Method of fabricating semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted May 8, 2007·0 cites·9 claims
- 4445US7241685B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Jul 10, 2007·1 cites·24 claims
- 4545US6545362B2Semiconductor device and method of manufacturing the sameHITACHI LTD·Filed 2001·Granted Apr 8, 2003·1 cites·18 claims
- 4643US10428422B2Film-forming methodPHILTECH INC·Filed 2017·Granted Oct 1, 2019·0 cites·10 claims
- 4743US6300237B1Semiconductor integrated circuit device and method for making the sameHITACHI LTD·Filed 1999·Granted Oct 9, 2001·7 cites·23 claims
- 4843US2004203321A1Manufacturing method of semiconductor device, automatic operation method and automatic operation system of semiconductor manufacturing apparatus, and automatic operation method of CMP apparatusTRECENTI TECHNOLOGIES INC·Filed 2004·Application pending·0 cites
- 4943US2010066619A1Magnetic coupling device and reading deviceFURUMURA YUJI·Filed 2007·Application pending·0 cites
- 5042US2004235289A1Semiconductor integrated circuit device and method for making the sameFiled 2004·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →