Inventor · disambiguated record
Kan-Jung Chia
Also filed as: CHIA KAN-JUNG
17 granted patents·7 pending applications·285 citations·filing 2007–2013
94Inventor score
Technology areasH10W
Files withPHOENIX PREC TECHNOLOGY CORP12UNIMICRON TECHNOLOGY CORP7CHIA KAN-JUNG3HSU SHIH-PING1HSU SHIN-PING1
Top patents by PatentIndex Score
24 records- 0198US7639473B2Circuit board structure with embedded electronic componentsPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Dec 29, 2009·121 cites·25 claims
- 0297US8999759B2Method for fabricating packaging structure having embedded semiconductor elementUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Apr 7, 2015·40 cites·11 claims
- 0390US7969745B2Circuit board structure having electronic components integrated thereinUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Jun 28, 2011·21 cites·19 claims
- 0487US7579690B2Semiconductor package structurePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Granted Aug 25, 2009·17 cites·20 claims
- 0586US7705446B2Package structure having semiconductor chip embedded therein and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Apr 27, 2010·14 cites·7 claims
- 0685US7582961B2Package structure with circuits directly connected to semiconductor chipPHOENIX PREC TECHNOLOGY CORP·Filed 2008·Granted Sep 1, 2009·13 cites·18 claims
- 0781US8461689B2Packaging structure having embedded semiconductor elementCHIA KAN-JUNG·Filed 2010·Granted Jun 11, 2013·6 cites·11 claims
- 0880US7829987B2Carrier structure embedded with semiconductor chips and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Nov 9, 2010·10 cites·5 claims
- 0979US7902676B2Stacked semiconductor device and fabricating method thereofUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Mar 8, 2011·9 cites·16 claims
- 1078US7768119B2Carrier structure embedded with semiconductor chipPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Aug 3, 2010·8 cites·12 claims
- 1176US7598610B2Plate structure having chip embedded therein and the manufacturing method of the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Oct 6, 2009·7 cites·7 claims
- 1274US7973397B2Package substrate having embedded semiconductor chip and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2009·Granted Jul 5, 2011·7 cites·6 claims
- 1373US8035127B2Packaging substrate structure with a semiconductor chip embedded thereinUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Oct 11, 2011·6 cites·9 claims
- 1466US8058718B2Package substrate embedded with semiconductor componentHSU SHIH-PING·Filed 2008·Granted Nov 15, 2011·3 cites·11 claims
- 1563US8058723B2Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereofCHIA KAN-JUNG·Filed 2008·Granted Nov 15, 2011·3 cites·4 claims
- 1647US2009168380A1Package substrate embedded with semiconductor componentPHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 1746US8129835B2Package substrate having semiconductor component embedded therein and fabrication method thereofCHIA KAN-JUNG·Filed 2009·Granted Mar 6, 2012·0 cites·7 claims
- 1846US2009102039A1Package on package structurePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 1945US2008251915A1Structure of semiconductor chip and package structure having semiconductor chip embedded thereinPHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 2044US2009032930A1Packaging substrate having chip embedded therein and manufacturing method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2143US8129829B2Package substrate having embedded photosensitive semiconductor chip and fabrication method thereofHSU SHIN-PING·Filed 2009·Granted Mar 6, 2012·0 cites·14 claims
- 2243US2008029872A1Plate structure having chip embedded therein and the manufacturing method of the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2343US2008185704A1Carrier plate structure havign a chip embedded therein and the manufacturing method of the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2436US2011031606A1Packaging substrate having embedded semiconductor chipUNIMICRON TECHNOLOGY CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →