Inventor · disambiguated record
Miwa Kozawa
Also filed as: KOZAWA MIWA
46 granted patents·12 pending applications·351 citations·filing 1999–2016
98Inventor score
Top patents by PatentIndex Score
58 records- 0196US7608386B2Resist cover film-forming material, process for forming resist pattern, semiconductor device and process for manufacturing the sameFUJITSU LTD·Filed 2006·Granted Oct 27, 2009·79 cites·19 claims
- 0291US6342562B1Silicon-containing polymer, process for its production, resist composition employing it, pattern-forming method and electronic device fabrication methodFUJITSU LTD·Filed 2000·Granted Jan 29, 2002·41 cites·9 claims
- 0388US6506534B1Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2000·Granted Jan 14, 2003·29 cites·11 claims
- 0487US7585610B2Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the sameFUJITSU LTD·Filed 2006·Granted Sep 8, 2009·9 cites·5 claims
- 0583US7488569B2Negative resist composition, a method for forming a resist pattern thereof, and a method for fabricating a semiconductor deviceFUJITSU LTD·Filed 2006·Granted Feb 10, 2009·5 cites·18 claims
- 0682US8334091B2Resist pattern swelling material, and method for patterning using sameNOZAKI KOJI·Filed 2008·Granted Dec 18, 2012·7 cites·15 claims
- 0781US7338750B2Resist pattern thickness reducing material, resist pattern and process for forming thereof, and semiconductor device and process for manufacturing thereofFUJITSU LTD·Filed 2002·Granted Mar 4, 2008·25 cites·19 claims
- 0879US7820367B2Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for producing the sameFUJITSU LTD·Filed 2005·Granted Oct 26, 2010·4 cites·8 claims
- 0979US6541077B1Silicon-containing polymer, process for its production, resist composition employing it, pattern-forming method and electronic device fabrication methodFUJITSU LTD·Filed 2001·Granted Apr 1, 2003·16 cites·15 claims
- 1075US8906598B2Pattern forming method, method for manufacturing semiconductor device, and material for forming coating layer of resist patternKOZAWA MIWA·Filed 2011·Granted Dec 9, 2014·3 cites·9 claims
- 1175US7189783B2Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereofFUJITSU LTD·Filed 2002·Granted Mar 13, 2007·13 cites·20 claims
- 1274US8349542B2Manufacturing process of semiconductor deviceFUJITSU LTD·Filed 2010·Granted Jan 8, 2013·2 cites·4 claims
- 1374US7744768B2Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereofFUJITSU LTD·Filed 2006·Granted Jun 29, 2010·3 cites·7 claims
- 1473US8945822B2Resist pattern thickening material, method for forming resist pattern, semiconductor device and method for manufacturing the sameFUJITSU LTD·Filed 2013·Granted Feb 3, 2015·2 cites·11 claims
- 1573US7799508B2Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the sameFUJITSU LTD·Filed 2009·Granted Sep 21, 2010·3 cites·24 claims
- 1673US7625688B2Resist pattern thickening material, resist pattern and process for forming the same, and semiconductor device and process for manufacturing the sameFUJITSU LTD·Filed 2005·Granted Dec 1, 2009·4 cites·35 claims
- 1772US8129092B2Resist pattern thickening material and process for forming resist pattern, and semiconductor device and method for manufacturing the sameKOZAWA MIWA·Filed 2006·Granted Mar 6, 2012·3 cites·2 claims
- 1872US8119325B2Method for forming resist pattern, semiconductor device and production method thereofKOZAWA MIWA·Filed 2006·Granted Feb 21, 2012·3 cites·10 claims
- 1970US8795949B2Resist pattern improving material, method for forming resist pattern, and method for producing semiconductor deviceKOZAWA MIWA·Filed 2011·Granted Aug 5, 2014·2 cites·19 claims
- 2068US7416837B2Resist pattern-improving material and a method for preparing a resist pattern by using the sameFUJITSU LTD·Filed 2002·Granted Aug 26, 2008·11 cites·18 claims
- 2167US8420288B2Resist pattern thickening material, method for forming resist pattern, semiconductor device and method for manufacturing the sameNOZAKI KOJI·Filed 2007·Granted Apr 16, 2013·2 cites·7 claims
- 2267US7439010B2Alkali-soluble siloxane polymer, positive type resist composition, resist pattern, process for forming the same, electronic device and process for manufacturing the sameFUJITSU LTD·Filed 2005·Granted Oct 21, 2008·2 cites·15 claims
- 2367US6773867B2Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2002·Granted Aug 10, 2004·7 cites·39 claims
- 2466US8198014B2Resist cover film forming material, resist pattern forming method, and electronic device and method for manufacturing the sameKOZAWA MIWA·Filed 2007·Granted Jun 12, 2012·2 cites·13 claims
- 2566US6770417B2Negative resist composition, process for forming resist patterns, and process for manufacturing electron deviceFUJITSU LTD·Filed 2001·Granted Aug 3, 2004·20 cites·37 claims
- 2665US6949324B2Alkali-soluble siloxane polymer, positive type resist composition, resist pattern, process for forming the same, electronic device and process for manufacturing the sameFUJITSU LTD·Filed 2002·Granted Sep 27, 2005·7 cites·26 claims
- 2764US7452657B2Resist composition, method of forming resist pattern, semiconductor device and method of manufacturing thereofFUJITSU LTD·Filed 2005·Granted Nov 18, 2008·1 cites·18 claims
- 2860US7662539B2Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor deviceFUJITSU LTD·Filed 2004·Granted Feb 16, 2010·6 cites·56 claims
- 2960US7592127B2Resist pattern thickening material, resist pattern and process for forming the same, and semiconductor device and process for manufacturing the sameFUJITSU LTD·Filed 2003·Granted Sep 22, 2009·7 cites·30 claims
- 3060US7122288B2Negative resist composition, a method for forming a resist pattern thereof, and a method for fabricating a semiconductor deviceFUJITSU LTD·Filed 2002·Granted Oct 17, 2006·4 cites·29 claims
- 3160US6794112B2Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2002·Granted Sep 21, 2004·4 cites·6 claims
- 3259US7144968B2Silicon-containing polymer, process for its production, resist composition employing it, pattern-forming method and electronic device fabrication methodFUJITSU LTD·Filed 2001·Granted Dec 5, 2006·4 cites·10 claims
- 3357US6794113B2Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2002·Granted Sep 21, 2004·3 cites·20 claims
- 3456US7550248B2Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the sameFUJITSU LTD·Filed 2005·Granted Jun 23, 2009·4 cites·17 claims
- 3555US8338080B2Process for forming resist pattern, semiconductor device and fabrication thereofKOZAWA MIWA·Filed 2003·Granted Dec 25, 2012·4 cites·18 claims
- 3653US8652751B2Resist composition, method for forming resist pattern, and method for producing electronic deviceKOZAWA MIWA·Filed 2009·Granted Feb 18, 2014·0 cites·13 claims
- 3753US7361448B2Resist pattern thickening material and process for forming the same, and semiconductor device and process for manufacturing the sameFUJITSU LTD·Filed 2004·Granted Apr 22, 2008·3 cites·30 claims
- 3853US6787288B2Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2002·Granted Sep 7, 2004·2 cites·22 claims
- 3952US8198009B2Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for producing the sameKOZAWA MIWA·Filed 2010·Granted Jun 12, 2012·0 cites·22 claims
- 4050US7611819B2Resist composition, method for forming resist pattern, and semiconductor device and method for manufacturing the sameFUJITSU LTD·Filed 2006·Granted Nov 3, 2009·0 cites·18 claims
- 4149US8945816B2Method for forming resist pattern, semiconductor device and production method thereofKOZAWA MIWA·Filed 2011·Granted Feb 3, 2015·0 cites·3 claims
- 4249US2012126372A1Resist pattern thickening material and process for forming resist pattern, and semiconductor device and method for manufacturing the sameKOZAWA MIWA·Filed 2012·Application pending·0 cites
- 4348US2009061359A1Resist composition for immersion exposure and method for manufacturing a semiconductor device using the sameFUJITSU LTD·Filed 2008·Application pending·0 cites
- 4445US8980535B2Resist pattern improving material, method for forming resist pattern, and method for producing semiconductor deviceKOZAWA MIWA·Filed 2011·Granted Mar 17, 2015·0 cites·4 claims
- 4545US2005038216A1Silicon-containing polymer, process for its production, resist composition employing it, pattern-forming method and electronic device fabrication methodFUJITSU LTD·Filed 2004·Application pending·0 cites
- 4645US2008044770A1Process for forming resist pattern, semiconductor device and manufacturing method for the sameFUJITSU LTD·Filed 2006·Application pending·0 cites
- 4744US8748077B2Resist pattern improving material, method for forming resist pattern, method for producing semiconductor device, and semiconductor deviceNOZAKI KOJI·Filed 2012·Granted Jun 10, 2014·0 cites·6 claims
- 4843US2014057437A1Rinsing agent for lithography, method for forming a resist pattern, and method for producing a semiconductor deviceFUJITSU LTD·Filed 2013·Application pending·0 cites
- 4942US7364829B2Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor deviceFUJITSU LTD·Filed 2003·Granted Apr 29, 2008·0 cites·24 claims
- 5042US2003175624A1Resist pattern swelling material, and method for patterning using sameFUJITSU LTD·Filed 2003·Application pending·0 cites
Showing the top 50 of 58 patent records by PatentIndex Score.
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