Inventor · disambiguated record
Javier Solo Gonzalez
Also filed as: SOLO GONZALEZ JAVIER
1 granted patent·1 pending application·0 citations·filing 2014–2014
14Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0153US9406618B2Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameINTEL CORP·Filed 2014·Granted Aug 2, 2016·0 cites·32 claims
- 0250US2014327149A1Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameGUZEK JOHN S·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →