Inventor · disambiguated record
Mike Breeden
Also filed as: BREEDEN MIKE
1 granted patent·1 pending application·0 citations·filing 2021–2024
13Inventor score
Technology areasH10W
Files withUNIV CALIFORNIA2
Top patents by PatentIndex Score
2 records- 0168US2024347502A1Methods of forming stacked integrated circuits using selective thermal atomic layer deposition on conductive contacts and structures formed using the sameUNIV CALIFORNIA·Filed 2024·Application pending·0 cites
- 0263US12027488B2Methods of forming stacked integrated circuits using selective thermal atomic layer deposition on conductive contacts and structures formed using the sameUNIV CALIFORNIA·Filed 2021·Granted Jul 2, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →