Inventor · disambiguated record
Ki-Kwon Jeong
Also filed as: JEONG KI-KWON
11 granted patents·6 pending applications·349 citations·filing 1996–2012
90Inventor score
Top patents by PatentIndex Score
17 records- 0195US7494845B2Method of forming a thin wafer stack for a wafer level packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 24, 2009·247 cites·23 claims
- 0284US7294531B2Wafer level chip stack methodSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 13, 2007·44 cites·18 claims
- 0378US7051428B2In line system used in a semiconductor package assemblingSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 30, 2006·18 cites·8 claims
- 0471US8941245B2Semiconductor package including semiconductor chip with through openingLEE CHANG-CHEOL·Filed 2012·Granted Jan 27, 2015·4 cites·19 claims
- 0567US7129118B2Protective tape removing apparatus and method of assembling semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Oct 31, 2006·11 cites·15 claims
- 0666US7479455B2Method for manufacturing semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 20, 2009·3 cites·22 claims
- 0757US7262114B2Die attaching method of semiconductor chip using warpage prevention materialSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 28, 2007·1 cites·14 claims
- 0856US2009141275A1Alignment inspection method and alignment inspection apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0949US8796597B2In-line package apparatuses and methodsKIM MIN-ILL·Filed 2008·Granted Aug 5, 2014·1 cites·22 claims
- 1049US6923077B2Apparatus and method for wafer backside inspectionSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 2, 2005·4 cites·25 claims
- 1149US2009134202A1Reflow apparatus and methodSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1249US2006177954A1Dicing tape attaching unit that can attach pre-cut dicing tape and general dicing tape to wafer and in-line system having the dicing tape attaching unitSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1348US5898226ASemiconductor chip having a bonding window smaller than a wire ballSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Apr 27, 1999·16 cites·11 claims
- 1448US2009321432A1Apparatus for Processing a WaferHAN II-YOUNG·Filed 2009·Application pending·0 cites
- 1539US2006202332A1Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1637US8149404B2Method for aligning wafer and alignment apparatus using the methodCHOI YOUNG-SHIN·Filed 2009·Granted Apr 3, 2012·0 cites·16 claims
- 1735US2006151878A1Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip packageJEONG SE-YOUNG·Filed 2006·Application pending·0 cites
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