Inventor · disambiguated record
Satyanarayana V. Nitta
Also filed as: NITTA SATYANARAYANA · NITTA SATYANARAYANA V · NITTA SATYANARAYANA VENKATA
89 granted patents·24 pending applications·2,220 citations·filing 2000–2023
99Inventor score
Top patents by PatentIndex Score
113 records- 0199US9324650B2Interconnect structures with fully aligned viasIBM·Filed 2014·Granted Apr 26, 2016·79 cites·7 claims
- 0299US6413852B1Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder materialIBM·Filed 2000·Granted Jul 2, 2002·264 cites·25 claims
- 0398US8525169B1Reliable physical unclonable function for device authenticationEDELSTEIN DANIEL C·Filed 2012·Granted Sep 3, 2013·115 cites·23 claims
- 0498US8241992B2Method for air gap interconnect integration using photo-patternable low k materialCLEVENGER LAWRENCE A·Filed 2010·Granted Aug 14, 2012·422 cites·18 claims
- 0598US7037744B2Method for fabricating a self-aligned nanocolumnar airbridge and structure produced therebyIBM·Filed 2005·Granted May 2, 2006·84 cites·20 claims
- 0697US6451712B1Method for forming a porous dielectric material layer in a semiconductor device and device formedIBM·Filed 2000·Granted Sep 17, 2002·123 cites·43 claims
- 0796US8288268B2Microelectronic structure including air gapEDELSTEIN DANIEL C·Filed 2010·Granted Oct 16, 2012·24 cites·20 claims
- 0896US6911400B2Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for sameIBM·Filed 2002·Granted Jun 28, 2005·79 cites·49 claims
- 0995US7534696B2Multilayer interconnect structure containing air gaps and method for makingIBM·Filed 2006·Granted May 19, 2009·42 cites·13 claims
- 1094US7790601B1Forming interconnects with air gapsIBM·Filed 2009·Granted Sep 7, 2010·26 cites·18 claims
- 1194US6346484B1Method for selective extraction of sacrificial place-holding material used in fabrication of air gap-containing interconnect structuresIBM·Filed 2000·Granted Feb 12, 2002·80 cites·12 claims
- 1293US10629086B2Providing targeted, evidence-based recommendations to improve content by combining static analysis and usage analysisIBM·Filed 2015·Granted Apr 21, 2020·6 cites·20 claims
- 1393US9105693B2Microelectronic structure including air gapEDELSTEIN DANIEL C·Filed 2012·Granted Aug 11, 2015·11 cites·8 claims
- 1493US8431486B2Interconnect structure for improved time dependent dielectric breakdownCABRAL JR CYRIL·Filed 2010·Granted Apr 30, 2013·15 cites·19 claims
- 1593US7030495B2Method for fabricating a self-aligned nanocolumnar airbridge and structure produced therebyIBM·Filed 2004·Granted Apr 18, 2006·64 cites·14 claims
- 1693US6737725B2Multilevel interconnect structure containing air gaps and method for makingIBM·Filed 2002·Granted May 18, 2004·70 cites·12 claims
- 1792US9911690B2Interconnect structures with fully aligned viasIBM·Filed 2016·Granted Mar 6, 2018·6 cites·12 claims
- 1892US8642252B2Methods for fabrication of an air gap-containing interconnect structureCLEVENGER LAWRENCE A·Filed 2010·Granted Feb 4, 2014·13 cites·17 claims
- 1992US7943480B2Sub-lithographic dimensioned air gap formation and related structureIBM·Filed 2008·Granted May 17, 2011·18 cites·13 claims
- 2092US7179758B2Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectricsIBM·Filed 2004·Granted Feb 20, 2007·50 cites·79 claims
- 2192US6641899B1Nonlithographic method to produce masks by selective reaction, articles produced, and composition for sameIBM·Filed 2002·Granted Nov 4, 2003·43 cites·11 claims
- 2291US9054160B2Interconnect structure and method for fabricating on-chip interconnect structures by image reversalBRUCE ROBERT L·Filed 2011·Granted Jun 9, 2015·12 cites·18 claims
- 2391US8129286B2Reducing effective dielectric constant in semiconductor devicesEDELSTEIN DANIEL C·Filed 2008·Granted Mar 6, 2012·11 cites·32 claims
- 2491US7892940B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2007·Granted Feb 22, 2011·11 cites·25 claims
- 2591US7405147B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2004·Granted Jul 29, 2008·35 cites·31 claims
- 2691US6603204B2Low-k interconnect structure comprised of a multilayer of spin-on porous dielectricsIBM·Filed 2001·Granted Aug 5, 2003·54 cites·29 claims
- 2790US8779600B2Interlevel dielectric stack for interconnect structuresNGUYEN SON VAN·Filed 2012·Granted Jul 15, 2014·8 cites·14 claims
- 2890US8120179B2Air gap interconnect structures and methods for forming the sameCHANDA KAUSHIK·Filed 2009·Granted Feb 21, 2012·19 cites·18 claims
- 2990US6677680B2Hybrid low-k interconnect structure comprised of 2 spin-on dielectric materialsIBM·Filed 2001·Granted Jan 13, 2004·54 cites·25 claims
- 3089US8624323B2BEOL structures incorporating active devices and mechanical strengthGATES STEPHEN M·Filed 2011·Granted Jan 7, 2014·7 cites·24 claims
- 3189US8343868B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2011·Granted Jan 1, 2013·6 cites·20 claims
- 3289US7371684B2Process for preparing electronics structures using a sacrificial multilayer hardmask schemeIBM·Filed 2005·Granted May 13, 2008·12 cites·21 claims
- 3388US8383507B2Method for fabricating air gap interconnect structuresIBM·Filed 2012·Granted Feb 26, 2013·8 cites·19 claims
- 3488US7749892B2Embedded nano UV blocking and diffusion barrier for improved reliability of copper/ultra low K interlevel dielectric electronic devicesIBM·Filed 2006·Granted Jul 6, 2010·16 cites·3 claims
- 3588US7687913B2Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectricsIBM·Filed 2007·Granted Mar 30, 2010·10 cites·8 claims
- 3687US7592685B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2007·Granted Sep 22, 2009·7 cites·20 claims
- 3786US8003520B2Air gap structure having protective metal silicide pads on a metal featureIBM·Filed 2010·Granted Aug 23, 2011·6 cites·10 claims
- 3886US6930034B2Robust ultra-low k interconnect structures using bridge-then-metallization fabrication sequenceIBM·Filed 2002·Granted Aug 16, 2005·43 cites·19 claims
- 3985US8952539B2Methods for fabrication of an air gap-containing interconnect structureIBM·Filed 2014·Granted Feb 10, 2015·5 cites·15 claims
- 4084US8357608B2Multi component dielectric layerIBM·Filed 2010·Granted Jan 22, 2013·5 cites·11 claims
- 4183US10506303B1Personalized video interjections based on learner model and learning objectiveIBM·Filed 2018·Granted Dec 10, 2019·4 cites·20 claims
- 4282US8237246B2Deep trench crackstops under contactsANGYAL MATTHEW S·Filed 2010·Granted Aug 7, 2012·7 cites·16 claims
- 4382US7435676B2Dual damascene process flow enabling minimal ULK film modification and enhanced stack integrityIBM·Filed 2006·Granted Oct 14, 2008·9 cites·9 claims
- 4481US11620993B2Multimodal intent entity resolverMERLYN MIND INC·Filed 2021·Granted Apr 4, 2023·1 cites·20 claims
- 4581US11164136B2Recommending personalized job recommendations from automated review of writing samples and resumesIBM·Filed 2016·Granted Nov 2, 2021·2 cites·26 claims
- 4681US9275936B2BEOL structures incorporating active devices and mechanical strengthGLOBALFOUNDRIES INC·Filed 2014·Granted Mar 1, 2016·3 cites·11 claims
- 4781US7084479B2Line level air gapsIBM·Filed 2003·Granted Aug 1, 2006·27 cites·15 claims
- 4881US6780499B2Ordered two-phase dielectric film, and semiconductor device containing the sameIBM·Filed 2001·Granted Aug 24, 2004·24 cites·57 claims
- 4980US7948051B2Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for sameIBM·Filed 2008·Granted May 24, 2011·4 cites·15 claims
- 5080US6716742B2Low-k interconnect structure comprised of a multilayer of spin-on porous dielectricsIBM·Filed 2002·Granted Apr 6, 2004·24 cites·57 claims
Showing the top 50 of 113 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →