Inventor · disambiguated record
Barbara Vasquez
Also filed as: VASQUEZ BARBARA
42 granted patents·3 pending applications·1,533 citations·filing 1989–2007
98Inventor score
Files withINFINEON TECHNOLOGIES AG24MOTOROLA INC17FORMFACTOR INC2INFINEON TECHNOLOGIES AG A GER1KHANDROS IGOR Y1
Top patents by PatentIndex Score
45 records- 0197US6727576B2Transfer wafer level packagingINFINEON TECHNOLOGIES AG·Filed 2001·Granted Apr 27, 2004·168 cites·16 claims
- 0295US6845554B2Method for connection of circuit unitsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 25, 2005·114 cites·7 claims
- 0394US6714418B2Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one anotherINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 30, 2004·89 cites·26 claims
- 0492US7230437B2Mechanically reconfigurable vertical tester interface for IC probingFORMFACTOR INC·Filed 2004·Granted Jun 12, 2007·47 cites·19 claims
- 0590US5136764AMethod for forming a field emission deviceMOTOROLA INC·Filed 1990·Granted Aug 11, 1992·66 cites·5 claims
- 0688US4994406AMethod of fabricating semiconductor devices having deep and shallow isolation structuresMOTOROLA INC·Filed 1989·Granted Feb 19, 1991·116 cites·16 claims
- 0787US5773986ASemiconductor wafer contact system and method for contacting a semiconductor waferMOTOROLA INC·Filed 1995·Granted Jun 30, 1998·65 cites·5 claims
- 0886US7074696B1Semiconductor circuit module and method for fabricating semiconductor circuit modulesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 11, 2006·43 cites·9 claims
- 0986US6709953B2Method of applying a bottom surface protective coating to a wafer, and wafer dicing methodINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 23, 2004·43 cites·4 claims
- 1085US6664176B2Method of making pad-rerouting for integrated circuit chipsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Dec 16, 2003·43 cites·29 claims
- 1183US5963315AMethod and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detectionMOTOROLA INC·Filed 1997·Granted Oct 5, 1999·69 cites·40 claims
- 1283US5578841AVertical MOSFET device having frontside and backside contactsMOTOROLA INC·Filed 1995·Granted Nov 26, 1996·64 cites·16 claims
- 1382US5455194AEncapsulation method for localized oxidation of silicon with trench isolationMOTOROLA INC·Filed 1995·Granted Oct 3, 1995·71 cites·16 claims
- 1481US6953708B2Method of producing a semiconductor component having a compliant buffer layerINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 11, 2005·30 cites·26 claims
- 1580US7659736B2Mechanically reconfigurable vertical tester interface for IC probingFORMFACTOR INC·Filed 2007·Granted Feb 9, 2010·8 cites·13 claims
- 1679US5175123AHigh-pressure polysilicon encapsulated localized oxidation of siliconMOTOROLA INC·Filed 1990·Granted Dec 29, 1992·59 cites·11 claims
- 1778US5629630ASemiconductor wafer contact system and method for contacting a semiconductor waferMOTOROLA INC·Filed 1995·Granted May 13, 1997·54 cites·27 claims
- 1877US8324725B2Stacked die moduleKHANDROS IGOR Y·Filed 2005·Granted Dec 4, 2012·11 cites·22 claims
- 1976US6638870B2Forming a structure on a waferINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 28, 2003·22 cites·21 claims
- 2075US5556808AMethod for aligning a semiconductor deviceMOTOROLA INC·Filed 1994·Granted Sep 17, 1996·54 cites·41 claims
- 2174US7176131B2Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Feb 13, 2007·14 cites·5 claims
- 2273US6744127B2Semiconductor chip, memory module and method for testing the semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 1, 2004·20 cites·3 claims
- 2373US5026663AMethod of fabricating a structure having self-aligned diffused junctionsMOTOROLA INC·Filed 1989·Granted Jun 25, 1991·39 cites·8 claims
- 2472US6919232B2Process for producing a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 19, 2005·18 cites·19 claims
- 2570US6756540B2Self-adhering chipINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 29, 2004·16 cites·19 claims
- 2667US6888256B2Compliant relief wafer level packagingINFINEON TECHNOLOGIES AG·Filed 2001·Granted May 3, 2005·14 cites·23 claims
- 2766US5004703AMultiple trench semiconductor structure methodMOTOROLA INC·Filed 1989·Granted Apr 2, 1991·30 cites·14 claims
- 2865US6916185B2Connection of integrated circuit to a substrateINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 12, 2005·12 cites·18 claims
- 2965US5108946AMethod of forming planar isolation regionsMOTOROLA INC·Filed 1990·Granted Apr 28, 1992·35 cites·21 claims
- 3063US6707746B2Fuse programmable I/O organizationINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 16, 2004·13 cites·63 claims
- 3162US5602491AIntegrated circuit testing board having constrained thermal expansion characteristicsMOTOROLA INC·Filed 1995·Granted Feb 11, 1997·28 cites·39 claims
- 3261US6521512B2Method for fabricating a thin, free-standing semiconductor device layer and for making a three-dimensionally integrated circuitINFINEON TECHNOLOGIES AG·Filed 2001·Granted Feb 18, 2003·10 cites·16 claims
- 3359US6905954B2Method for producing a semiconductor device and corresponding semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jun 14, 2005·8 cites·18 claims
- 3452US2007102826A1Electronic Component Having at Least One Semiconductor Chip and Flip-Chip Contacts, and Method for Producing the SameINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 3547US6826037B2Electronic structureINFINEON TECHNOLOGIES AG·Filed 2002·Granted Nov 30, 2004·2 cites·25 claims
- 3647US5084407AMethod for planarizing isolated regionsMOTOROLA INC·Filed 1991·Granted Jan 28, 1992·20 cites·9 claims
- 3747US2006244109A1Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regionsINFINEON TECHNOLOGIES AG A GER·Filed 2006·Application pending·0 cites
- 3846US5028559AFabrication of devices having laterally isolated semiconductor regionsMOTOROLA INC·Filed 1989·Granted Jul 2, 1991·13 cites·27 claims
- 3941US7087512B2Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regionsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 8, 2006·0 cites·10 claims
- 4038US7211451B2Process for producing a component moduleINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 1, 2007·0 cites·9 claims
- 4138US2003143819A1Method of producing semiconductor chips with a chip edge guard, in particular for wafer level packaging chipsINFINEON TECHNOLOGIES AG·Filed 2003·Application pending·0 cites
- 4237US7338843B2Method for producing an electronic component, especially a memory chipINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 4, 2008·0 cites·25 claims
- 4337US6861291B2Method producing a contact connection between a semiconductor chip and a substrate and the contact connectionINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 1, 2005·0 cites·8 claims
- 4432USRE35294EPolysilicon encapsulated localized oxidation of siliconMOTOROLA INC·Filed 1994·Granted Jul 9, 1996·4 cites·12 claims
- 4532US5156705ANon-homogeneous multi-elemental electron emitterMOTOROLA INC·Filed 1990·Granted Oct 20, 1992·1 cites·6 claims
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