Inventor · disambiguated record
Wilhelmus Gerardus Jozef Gal
Also filed as: GAL WILHELMUS GERARDUS JOSEPH · GAL WILHELMUS GERARDUS JOZEF
7 granted patents·2 pending applications·3 citations·filing 2003–2025
72Inventor score
Top patents by PatentIndex Score
9 records- 0174US2025353226A1Method and Mould for Encapsulating Electronic Components Mounted on a CarrierBESI NETHERLANDS BV·Filed 2025·Application pending·0 cites
- 0267US11217463B2Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuatorsBESI NETHERLANDS BV·Filed 2016·Granted Jan 4, 2022·2 cites·13 claims
- 0360US12420465B2Method and mould for encapsulating electronic components mounted on a carrierBESI NETHERLANDS BV·Filed 2021·Granted Sep 23, 2025·0 cites·6 claims
- 0457US11842909B2Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuatorsBESI NETHERLANDS BV·Filed 2021·Granted Dec 12, 2023·0 cites·8 claims
- 0544US12384081B2Mould half and mould method for transfer moulding encapsulating electronic components mounted on a carrier including a dual support surface and a method for using suchBESI NETHERLANDS BV·Filed 2019·Granted Aug 12, 2025·0 cites·18 claims
- 0644US7608486B2Device and method for encapsulating with encapsulating material and electronic component fixed on a carrierFICO BV·Filed 2004·Granted Oct 27, 2009·1 cites·11 claims
- 0742US9831105B2Method for moulding and surface processing electronic components and electronic component produced with this methodBESI NETHERLANDS BV·Filed 2014·Granted Nov 28, 2017·0 cites·12 claims
- 0841US2009115098A1Mould Part and Method for Encapsulating Electronic ComponentsFICO BV·Filed 2005·Application pending·0 cites
- 0931US7425469B2Method for encapsulating an electronic component using a foil layerFICO BV·Filed 2003·Granted Sep 16, 2008·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →