Inventor · disambiguated record
Stefan Finkbeiner
Also filed as: FINKBEINER STEFAN
7 granted patents·6 pending applications·46 citations·filing 2000–2010
81Inventor score
Top patents by PatentIndex Score
13 records- 0192US7354786B2Sensor element with trenched cavityBOSCH GMBH ROBERT·Filed 2005·Granted Apr 8, 2008·27 cites·11 claims
- 0263US8687255B2Method for manufacturing a micromechanical component, and micromechanical componentFINKBEINER STEFAN·Filed 2009·Granted Apr 1, 2014·3 cites·9 claims
- 0360US7740459B2Micropump having a pump diaphragm and a polysilicon layerBOSCH GMBH ROBERT·Filed 2004·Granted Jun 22, 2010·6 cites·3 claims
- 0458US7572660B2Electrical through-plating of semiconductor chipsBOSCH GMBH ROBERT·Filed 2004·Granted Aug 11, 2009·6 cites·12 claims
- 0551US6511913B1Method for manufacturing a membraneBOSCH GMBH ROBERT·Filed 2000·Granted Jan 28, 2003·4 cites·10 claims
- 0648US2008041151A1Microfluidic device, in particular for metering a fluid or for the metered dispensing of a fluid, and method for producing a microfluidic deviceFUERTSCH MATTHIAS·Filed 2007·Application pending·0 cites
- 0741US7572661B2Method for manufacturing a micromechanical sensor elementBOSCH GMBH ROBERT·Filed 2005·Granted Aug 11, 2009·0 cites·21 claims
- 0841US2007128755A1Micronozzle plate and manufacturing methodFUERTSCH MATTHIAS·Filed 2006·Application pending·0 cites
- 0936US2006037932A1Method and micromechanical componentLAMMEL GERHARD·Filed 2003·Application pending·0 cites
- 1036US2005022593A1Fluid flow sensorFiled 2004·Application pending·0 cites
- 1135US8198130B2Chip module and method for producing a chip module having plains of extensions for chip and substrateFINKBEINER STEFAN·Filed 2010·Granted Jun 12, 2012·0 cites·10 claims
- 1233US2011108932A1Micromechanical Capacitive Sensor ElementBENZEL HUBERT·Filed 2005·Application pending·0 cites
- 1332US2006016995A1Microstructured infrared sensor and method for its manufactureKUMMER NILS·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →