Inventor · disambiguated record
Yoshiaki Emoto
Also filed as: EMOTO YOSHIAKI
12 granted patents·1 pending application·616 citations·filing 1990–2003
94Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0194US6593648B2Semiconductor device and method of making the same, circuit board and electronic equipmentSEIKO EPSON CORP·Filed 2001·Granted Jul 15, 2003·102 cites·14 claims
- 0291US6646335B2Flexible tape carrier with external terminals formed on interposersSEIKO EPSON CORP·Filed 2002·Granted Nov 11, 2003·60 cites·6 claims
- 0389US6441476B1Flexible tape carrier with external terminals formed on interposersSEIKO EPSON CORP·Filed 2000·Granted Aug 27, 2002·50 cites·7 claims
- 0489US5188280AMethod of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metalsHITACHI LTD·Filed 1991·Granted Feb 23, 1993·114 cites·31 claims
- 0586US5090609AMethod of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metalsHITACHI LTD·Filed 1990·Granted Feb 25, 1992·98 cites·24 claims
- 0683US6664643B2Semiconductor device and method for manufacturing the sameSEIKO EPSON CORP·Filed 2001·Granted Dec 16, 2003·31 cites·17 claims
- 0778US5223454AMethod of manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1991·Granted Jun 29, 1993·63 cites·11 claims
- 0867US6717250B1Stacked semiconductor apparatus and electronic device including stacked semiconductor apparatusSEIKO EPSON CORP·Filed 2000·Granted Apr 6, 2004·15 cites·17 claims
- 0966US5422163AFlexible substrate with projections to block resin flowNIPPON STEEL CORP·Filed 1993·Granted Jun 6, 1995·40 cites·23 claims
- 1055US5362984ASemiconductor device with jumping wireNIPPON STEEL CORP·Filed 1992·Granted Nov 8, 1994·24 cites·21 claims
- 1144US5049972AMethod of manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1990·Granted Sep 17, 1991·14 cites·16 claims
- 1239US2004063247A1Semiconductor device and method for manufacturing the sameFiled 2003·Application pending·0 cites
- 1335US6118173ALead frame and a semiconductor deviceNIPPON STEEL SEMICONDUCTOR·Filed 1997·Granted Sep 12, 2000·5 cites·7 claims
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