Inventor · disambiguated record
Yoshiaki Narisawa
Also filed as: NARISAWA YOSHIAKI
6 granted patents·1 pending application·53 citations·filing 2006–2015
80Inventor score
Top patents by PatentIndex Score
7 records- 0192US7906852B2Semiconductor device and manufacturing method of the sameFUJITSU SEMICONDUCTOR LTD·Filed 2007·Granted Mar 15, 2011·31 cites·11 claims
- 0281US8841776B2Stacked semiconductor chips having double adhesive insulating layer interposed therebetweenNISHIMURA TAKAO·Filed 2008·Granted Sep 23, 2014·11 cites·12 claims
- 0378US8134240B2Semiconductor device and manufacturing method for the sameNISHIMURA TAKAO·Filed 2009·Granted Mar 13, 2012·7 cites·3 claims
- 0465US7973404B2Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Jul 5, 2011·3 cites·14 claims
- 0555US8230590B2Method for mounting electronic componentsNISHIMURA TAKAO·Filed 2008·Granted Jul 31, 2012·1 cites·12 claims
- 0647US2008023831A1Semiconductor device and manufacturing method for the sameFUJITSU LTD·Filed 2006·Application pending·0 cites
- 0733US9922923B2Method of manufacturing wiring substrate and wiring substrateKK EASTERN·Filed 2015·Granted Mar 20, 2018·0 cites·7 claims
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