Inventor · disambiguated record
Yi-Chuan Huang
Also filed as: HUANG YI · HUANG YI CHUAN
3 granted patents·8 pending applications·0 citations·filing 2007–2024
37Inventor score
Top patents by PatentIndex Score
11 records- 0161US2025105890A1Antenna group power level capability informationQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0255US2025233028A1Micro-led wafer testing device and micro-led wafer testing methodINGENTEC CORP·Filed 2024·Application pending·0 cites
- 0351US2024339579A1Light-emitting diode package structure and manufacturing method thereofINGENTEC CORP·Filed 2023·Application pending·0 cites
- 0450US12489093B2Magnetic LED die transferring device and magnetic LED die transferring methodINGENTEC CORP·Filed 2023·Granted Dec 2, 2025·0 cites·10 claims
- 0550US2023170434A1Vertical light-emitting diode and method for fabricating the sameINGENTEC CORP·Filed 2022·Application pending·0 cites
- 0649US2024304749A1Encapsulation process method for wafer-level light-emitting diode diesINGENTEC CORP·Filed 2023·Application pending·0 cites
- 0748US12101648B2Wireless communication system and method for performing communication and computingFg innovation co ltd·Filed 2021·Granted Sep 24, 2024·0 cites·19 claims
- 0846US12150242B2LED circuit board structure and LED testing and packaging methodINGENTEC CORP·Filed 2022·Granted Nov 19, 2024·0 cites·7 claims
- 0946US2024006557A1Led circuit board structure, led testing and packaging method and led pixel packageINGENTEC CORP·Filed 2022·Application pending·0 cites
- 1042US2008202633A1Liquid fillerCHANG CHIH-KAI·Filed 2007·Application pending·0 cites
- 1121US2017152975A1Rotatable connector for connecting a fluid transmission pipeHUANG YI-CHUAN·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →