Assignee
INGENTEC CORP
TW·12 granted patents·13 pending applications·1 citations·filing 2017–2025
Top patents by PatentIndex Score
25 records- 0181US11508872B2Alignment module for transferring a magnetic light-emitting die and alignment method thereofINGENTEC CORP·Filed 2021·Granted Nov 22, 2022·1 cites·20 claims
- 0272US11791439B2Magnetic light-emitting structureINGENTEC CORP·Filed 2023·Granted Oct 17, 2023·0 cites·5 claims
- 0366US12487188B2Wafer defect analyzing device and wafer defect analyzing methodINGENTEC CORP·Filed 2024·Granted Dec 2, 2025·0 cites·15 claims
- 0463US2024178631A1Laser diode and laser diode manufacturing methodINGENTEC CORP·Filed 2023·Application pending·0 cites
- 0561US12593733B2Vertical light emitting diode die packaging methodINGENTEC CORP·Filed 2023·Granted Mar 31, 2026·0 cites·14 claims
- 0661US11621368B2Magnetic light-emitting structure and fabrication method for manufacturing a magnetic light-emitting elementINGENTEC CORP·Filed 2020·Granted Apr 4, 2023·0 cites·17 claims
- 0761US2025267982A1Vertical light-emitting diode package structure and manufacturing method thereofINGENTEC CORP·Filed 2024·Application pending·0 cites
- 0861US2025287727A1Light emitting diode chip and manufacturing method thereofINGENTEC CORP·Filed 2024·Application pending·0 cites
- 0960US2026082737A1Vertical flip-chip light emitting element and manufacturing method for vertical flip-chip light emitting elementINGENTEC CORP·Filed 2025·Application pending·0 cites
- 1057US2025331344A1Light emitting diode pixel package and manufacturing method for light emitting diode pixel packageINGENTEC CORP·Filed 2024·Application pending·0 cites
- 1156US12417964B2Via-filling method of through-glass via substrateINGENTEC CORP·Filed 2023·Granted Sep 16, 2025·0 cites·8 claims
- 1255US2025233028A1Micro-led wafer testing device and micro-led wafer testing methodINGENTEC CORP·Filed 2024·Application pending·0 cites
- 1354US12418011B2Bonding and transferring method for die package structuresINGENTEC CORP·Filed 2023·Granted Sep 16, 2025·0 cites·15 claims
- 1453US10622509B2Vertical type light emitting diode die and method for fabricating the sameINGENTEC CORP·Filed 2017·Granted Apr 14, 2020·0 cites·5 claims
- 1553US2026013280A1Double-sided display pixel package structure and method for fabricating the sameINGENTEC CORP·Filed 2024·Application pending·0 cites
- 1653US2025085216A1Examining method for a coating layer on a waferINGENTEC CORP·Filed 2023·Application pending·0 cites
- 1752US10622510B2Vertical type light emitting diode die and method for fabricating the sameINGENTEC CORP·Filed 2018·Granted Apr 14, 2020·0 cites·6 claims
- 1851US2024339579A1Light-emitting diode package structure and manufacturing method thereofINGENTEC CORP·Filed 2023·Application pending·0 cites
- 1950US12489093B2Magnetic LED die transferring device and magnetic LED die transferring methodINGENTEC CORP·Filed 2023·Granted Dec 2, 2025·0 cites·10 claims
- 2050US2023170434A1Vertical light-emitting diode and method for fabricating the sameINGENTEC CORP·Filed 2022·Application pending·0 cites
- 2149US2024304749A1Encapsulation process method for wafer-level light-emitting diode diesINGENTEC CORP·Filed 2023·Application pending·0 cites
- 2247US11769861B2Light-emitting diode packaging structure and method for fabricating the sameINGENTEC CORP·Filed 2021·Granted Sep 26, 2023·0 cites·8 claims
- 2346US12150242B2LED circuit board structure and LED testing and packaging methodINGENTEC CORP·Filed 2022·Granted Nov 19, 2024·0 cites·7 claims
- 2446US2024006557A1Led circuit board structure, led testing and packaging method and led pixel packageINGENTEC CORP·Filed 2022·Application pending·0 cites
- 2538US2020058523A1Gas etching deviceINGENTEC CORP·Filed 2018·Application pending·0 cites
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