Inventor · disambiguated record
Sheng-Chuan Huang
Also filed as: HUANG SHENG-CHUAN
1 granted patent·2 pending applications·12 citations·filing 2002–2004
36Inventor score
Files withKINSUS INTERCONNECT TECH CORP1
Top patents by PatentIndex Score
3 records- 0160US6969674B2Structure and method for fine pitch flip chip substrateKINSUS INTERCONNECT TECH CORP·Filed 2004·Granted Nov 29, 2005·12 cites·14 claims
- 0230US2004012097A1Structure and method for fine pitch flip chip substrateFiled 2002·Application pending·0 cites
- 0321US2004198044A1Stacking photoresist image transferring method for fabricating a packaging substrateFiled 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →