Inventor · disambiguated record
Harumi Yagi
Also filed as: YAGI HARUMI
3 granted patents·2 pending applications·91 citations·filing 1985–2019
67Inventor score
Top patents by PatentIndex Score
5 records- 0190US6109507AMethod of forming solder bumps and method of forming preformed solder bumpsFUJITSU LTD·Filed 1998·Granted Aug 29, 2000·88 cites·8 claims
- 0241US2021221017A1Ultrasonic punching apparatus and ultrasonic punching methodMARUYA TEXTILE CO LTD·Filed 2019·Application pending·0 cites
- 0339US9117788B2Heat sink device and method of repairing semiconductor deviceYAMAMOTO TSUYOSHI·Filed 2011·Granted Aug 25, 2015·0 cites·1 claims
- 0437US2012083151A1Method of detachment of connector, connector detachment tool, and connectorTAKADA RIE·Filed 2011·Application pending·0 cites
- 0524US4691855ATwin wire splitter systemFUJITSU LTD·Filed 1985·Granted Sep 8, 1987·3 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →