Inventor · disambiguated record
Ki-Jeong Moon
Also filed as: MOON KI-JEONG
6 granted patents·6 pending applications·6 citations·filing 2005–2013
71Inventor score
Top patents by PatentIndex Score
12 records- 0171US8945668B2Phenoxy resin composition for transparent plastic substrate and transparent plastic substrate using the sameTORAY ADVANCED MAT KOREA INC·Filed 2013·Granted Feb 3, 2015·2 cites·6 claims
- 0259US7960023B2Adhesive film for stacking semiconductor chipsTORAY ADVANCED MAT KOREA INC·Filed 2007·Granted Jun 14, 2011·3 cites·15 claims
- 0353US9090800B2Adhesive tape for manufacturing electronic componentsCHOI SUNG-HWAN·Filed 2009·Granted Jul 28, 2015·0 cites·5 claims
- 0446US8263428B2Polymer electrolytes for dye-sensitized solar cells and method for manufacturing modules of dye-sensitized solar cells using the sameSIM CHANG-HOON·Filed 2010·Granted Sep 11, 2012·0 cites·13 claims
- 0545US8524833B2High-efficiency light diffusing polymeric film and manufacturing method thereofSIM CHANG-HOON·Filed 2009·Granted Sep 3, 2013·1 cites·4 claims
- 0642US2012269990A1Phenoxy resin composition for transparent plastic substrate and transparent plastic substrate using the sameSIM CHANG-HOON·Filed 2011·Application pending·0 cites
- 0742US2009294046A1Anisotropic conductive film and adhesion method thereofTORAY SAEHAN INC·Filed 2007·Application pending·0 cites
- 0840US2011056623A1Lamination method of adhesive tape and lead frameTORAY SAEHAN INC·Filed 2009·Application pending·0 cites
- 0940US2010247906A1Heat-resistant adhesive sheetTORAY SAEHAN INC·Filed 2007·Application pending·0 cites
- 1037US8057894B2Adhesive tape for electronic componentsKIM SANG-PIL·Filed 2005·Granted Nov 15, 2011·0 cites·5 claims
- 1137US2010330278A1Method for treating high hydrophobic surface of substrateCHOI SUNG-HWAN·Filed 2010·Application pending·0 cites
- 1234US2011166258A1Resin composition for no-flow underfill, no-flow underfill flim using the same and manufacturing method thereofTORAY SAEHAN INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →