Inventor · disambiguated record
Shu-Chiao Kuo
Also filed as: KUO Shu-Chiao
2 granted patents·18 citations·filing 2015–2016
60Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0190US9496238B2Sloped bonding structure for semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Nov 15, 2016·10 cites·19 claims
- 0284US9984993B2Bonding structure for semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR INC·Filed 2016·Granted May 29, 2018·8 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →