Inventor · disambiguated record
Lalgudi M. Mahalingam
Also filed as: MAHALINGAM LALGUDI M
3 granted patents·3 citations·filing 2010–2014
56Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0171US8753983B2Die bonding a semiconductor deviceJANG JIN-WOOK·Filed 2010·Granted Jun 17, 2014·3 cites·8 claims
- 0255US9105599B2Semiconductor devices that include a die bonded to a substrate with a gold interface layerFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Aug 11, 2015·0 cites·20 claims
- 0354US9111901B2Methods for bonding a die and a substrateFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Aug 18, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →