Inventor · disambiguated record
Purushotham Kaushik Muthur Srinath
Also filed as: MUTHUR SRINATH PURUSHOTHAM KAUSHIK
14 granted patents·4 pending applications·8 citations·filing 2013–2025
85Inventor score
Top patents by PatentIndex Score
18 records- 0188US2025329604A1Microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2025·Application pending·0 cites
- 0284US12417958B2Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zoneINTEL CORP·Filed 2023·Granted Sep 16, 2025·0 cites·14 claims
- 0383US12347743B2Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 0481US2024014097A1Microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2023·Application pending·0 cites
- 0580US10361167B2Electronic assembly using bismuth-rich solderINTEL CORP·Filed 2015·Granted Jul 23, 2019·4 cites·17 claims
- 0676US9625256B1Device, system and method for alignment of an integrated circuit assemblyINTEL CORP·Filed 2015·Granted Apr 18, 2017·3 cites·20 claims
- 0767US12406906B2Through mold interconnect drill featureINTEL CORP·Filed 2023·Granted Sep 2, 2025·0 cites·22 claims
- 0867US12394773B2Laser ablation-based surface property modification and contamination removalINTEL CORP·Filed 2023·Granted Aug 19, 2025·0 cites·17 claims
- 0965US12315777B2Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zoneINTEL CORP·Filed 2019·Granted May 27, 2025·0 cites·23 claims
- 1062US8999765B2Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structuresINTEL CORP·Filed 2013·Granted Apr 7, 2015·1 cites·16 claims
- 1156US11705383B2Through mold interconnect drill featureINTEL CORP·Filed 2019·Granted Jul 18, 2023·0 cites·23 claims
- 1255US11551956B2Method and device for failure analysis using RF-based thermometryINTEL CORP·Filed 2020·Granted Jan 10, 2023·0 cites·20 claims
- 1353US12362340B2Laser ablation-based surface property modification and contamination removalINTEL CORP·Filed 2019·Granted Jul 15, 2025·0 cites·24 claims
- 1447US9230833B2Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structuresINTEL CORP·Filed 2015·Granted Jan 5, 2016·0 cites·16 claims
- 1540US11476120B2Method of sample preparation using dual ion beam trenchingINTEL CORP·Filed 2017·Granted Oct 18, 2022·0 cites·9 claims
- 1640US10607909B2Systems, methods, and apparatuses for implementing a thermal solution for 3D packagingINTEL CORP·Filed 2016·Granted Mar 31, 2020·0 cites·25 claims
- 1740US2022270976A1Microelectronic assemblies including bridgesSUN XIAOXUAN·Filed 2021·Application pending·0 cites
- 1836US2018283845A1Wavelength modulatable interferometerINTEL CORP·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →