Inventor · disambiguated record
Aiko Hirata
Also filed as: HIRATA AIKO
4 granted patents·0 citations·filing 2015–2018
56Inventor score
Files withDOWA ELECTRONICS MATERIALS CO LTD4
Top patents by PatentIndex Score
4 records- 0150US10008471B2Bonding material and bonding method using the sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Jun 26, 2018·0 cites·2 claims
- 0249US11270810B2Electrically conductive pasteDOWA ELECTRONICS MATERIALS CO LTD·Filed 2018·Granted Mar 8, 2022·0 cites·12 claims
- 0349US10580910B2Silver-coated copper powder and method for producing sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2017·Granted Mar 3, 2020·0 cites·28 claims
- 0449US10090275B2Bonding method using bonding materialDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Oct 2, 2018·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →