Inventor · disambiguated record
Patrick Robert Zippetelli
Also filed as: ZIPPETELLI PATRICK R · ZIPPETELLI PATRICK ROBERT
6 granted patents·242 citations·filing 1992–1999
87Inventor score
Files withIBM6
Top patents by PatentIndex Score
6 records- 0189US5953214ADual substrate package assembly coupled to a conducting memberIBM·Filed 1996·Granted Sep 14, 1999·117 cites·18 claims
- 0274US6046911ADual substrate package assembly having dielectric member engaging contacts at only three locationsIBM·Filed 1997·Granted Apr 4, 2000·44 cites·18 claims
- 0374US5288542AComposite for providing a rigid-flexible circuit board construction and method for fabrication thereofIBM·Filed 1992·Granted Feb 22, 1994·33 cites·25 claims
- 0460US5378306AComposite for providing a rigid-flexible circuit board construction and method for fabrication thereofIBM·Filed 1994·Granted Jan 3, 1995·17 cites·13 claims
- 0559US6226187B1Integrated circuit packageIBM·Filed 1999·Granted May 1, 2001·21 cites·16 claims
- 0643US6084299AIntegrated circuit package including a heat sink and an adhesiveIBM·Filed 1995·Granted Jul 4, 2000·10 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →