Inventor · disambiguated record
Krishna P. Murella
Also filed as: MURELLA KRISHNA · MURELLA KRISHNA P
22 granted patents·9 pending applications·40 citations·filing 1999–2022
91Inventor score
Top patents by PatentIndex Score
31 records- 0196US9305806B2Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applicationsAIR PROD & CHEM·Filed 2015·Granted Apr 5, 2016·9 cites·11 claims
- 0289US8974692B2Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applicationsAIR PROD & CHEM·Filed 2013·Granted Mar 10, 2015·5 cites·6 claims
- 0380US11078417B2Low oxide trench dishing chemical mechanical polishingVERSUM MAT US LLC·Filed 2019·Granted Aug 3, 2021·2 cites·5 claims
- 0470US10418247B2Composite abrasive particles for chemical mechanical planarization composition and method of use thereofAIR PROD & CHEM·Filed 2016·Granted Sep 17, 2019·1 cites·12 claims
- 0569US10109493B2Composite abrasive particles for chemical mechanical planarization composition and method of use thereofAIR PROD & CHEM·Filed 2016·Granted Oct 23, 2018·1 cites·21 claims
- 0667US10669449B2Composite abrasive particles for chemical mechanical planarization composition and method of use thereofVERSUM MAT US LLC·Filed 2018·Granted Jun 2, 2020·0 cites·21 claims
- 0763US11692110B2Low oxide trench dishing chemical mechanical polishingVERSUM MAT US LLC·Filed 2021·Granted Jul 4, 2023·0 cites·5 claims
- 0863US11667839B2Low oxide trench dishing chemical mechanical polishingVERSUM MAT US LLC·Filed 2021·Granted Jun 6, 2023·0 cites·9 claims
- 0957US11549034B2Oxide chemical mechanical planarization (CMP) polishing compositionsVERSUM MAT US LLC·Filed 2019·Granted Jan 10, 2023·0 cites·20 claims
- 1057US11111415B2Chemical mechanical planarization of films comprising elemental siliconVERSUM MAT US LLC·Filed 2019·Granted Sep 7, 2021·0 cites·13 claims
- 1156US12205061B2Shared data induced quality control for a chemical mechanical planarization processVERSUM MAT US LLC·Filed 2022·Granted Jan 21, 2025·0 cites·19 claims
- 1256US12091581B2High oxide film removal rate shallow trench (STI) chemical mechanical planarization (CMP) polishingVERSUM MAT US LLC·Filed 2020·Granted Sep 17, 2024·0 cites·6 claims
- 1356US11072726B2Low oxide trench dishing chemical mechanical polishingVERSUM MAT US LLC·Filed 2019·Granted Jul 27, 2021·0 cites·4 claims
- 1456US10894906B2Composite particles, method of refining and use thereofVERSUM MAT US LLC·Filed 2019·Granted Jan 19, 2021·0 cites·9 claims
- 1555US11326076B2Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with low abrasive concentration and a combination of chemical additivesVERSUM MAT US LLC·Filed 2020·Granted May 10, 2022·0 cites·24 claims
- 1654US2024395558A1Chemical Mechanical Planarization Polishing For Shallow Trench IsolationVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
- 1753US11608451B2Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with tunable silicon oxide and silicon nitride removal ratesVERSUM MAT US LLC·Filed 2020·Granted Mar 21, 2023·0 cites·18 claims
- 1852US2020095502A1High Oxide VS Nitride Selectivity, Low And Uniform Oxide Trench Dishing In Shallow Trench Isolation(STI) Chemical Mechanical Planarization Polishing(CMP)VERSUM MAT US LLC·Filed 2019·Application pending·0 cites
- 1951US11254839B2Low oxide trench dishing shallow trench isolation chemical mechanical planarization polishingVERSUM MAT US LLC·Filed 2019·Granted Feb 22, 2022·0 cites·22 claims
- 2051US2018244955A1Chemical Mechanical Planarization of Films Comprising Elemental SiliconVERSUM MAT US LLC·Filed 2018·Application pending·0 cites
- 2150US11180678B2Suppressing SiN removal rates and reducing oxide trench dishing for Shallow Trench Isolation (STI) processVERSUM MAT US LLC·Filed 2019·Granted Nov 23, 2021·0 cites·16 claims
- 2250US10421890B2Composite particles, method of refining and use thereofVERSUM MAT US LLC·Filed 2017·Granted Sep 24, 2019·0 cites·11 claims
- 2350US6555466B1Two-step chemical-mechanical planarization for damascene structures on semiconductor wafersSPEEDFAM CORP·Filed 1999·Granted Apr 29, 2003·17 cites·3 claims
- 2449US12234383B2Low dishing oxide CMP polishing compositions for shallow trench isolation applications and methods of making thereofVERSUM MAT US LLC·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 2547US2024297049A1High Oxide Removal Rates Shallow Trench Isolation Chemical Mechanical Planarization CompositionsVERSUM MAT US LLC·Filed 2020·Application pending·0 cites
- 2644US2020270479A1Shallow Trench Isolation Chemical And Mechanical Polishing SlurryVERSUM MAT US LLC·Filed 2020·Application pending·0 cites
- 2743US2020002607A1Low Oxide Trench Dishing Chemical Mechanical PolishingVERSUM MAT US LLC·Filed 2019·Application pending·0 cites
- 2842US2006255016A1Method for polishing copper on a workpiece surfaceNOVELLUS SYSTEMS INC·Filed 2006·Application pending·0 cites
- 2941US2019127607A1Composite Particles, Method of Refining and Use ThereofVERSUM MAT US LLC·Filed 2018·Application pending·0 cites
- 3033US6387188B1Pad conditioning for copper-based semiconductor wafersSPEEDFAM IPEC CORP·Filed 1999·Granted May 14, 2002·5 cites·5 claims
- 3133US2016122590A1Chemical Mechanical Polishing Slurry for Reducing Corrosion and Method of Use ThereforAIR PROD & CHEM·Filed 2015·Application pending·0 cites
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