Inventor · disambiguated record
Malcolm Grief
Also filed as: GRIEF MALCOLM · GRIEF MALCOLM K
34 granted patents·2 pending applications·1,316 citations·filing 1989–2018
98Inventor score
Top patents by PatentIndex Score
36 records- 0199US7026835B2Engagement probe having a grouping of projecting apexes for engaging a conductive padMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 11, 2006·109 cites·16 claims
- 0299US5326428AMethod for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operabilityMICRON SEMICONDUCTOR INC·Filed 1993·Granted Jul 5, 1994·327 cites·20 claims
- 0398US5523697ATesting apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereofMICRON TECHNOLOGY INC·Filed 1994·Granted Jun 4, 1996·129 cites·33 claims
- 0497US8666505B2Wafer-scale package including power sourceO'BRIEN RICHARD J·Filed 2011·Granted Mar 4, 2014·50 cites·20 claims
- 0597US5514245AMethod for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratchesMICRON TECHNOLOGY INC·Filed 1995·Granted May 7, 1996·276 cites·17 claims
- 0695US5738562AApparatus and method for planar end-point detection during chemical-mechanical polishingMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 14, 1998·149 cites·41 claims
- 0787US9978609B2Low dishing copper chemical mechanical planarizationAIR PROD & CHEM·Filed 2016·Granted May 22, 2018·6 cites·12 claims
- 0883US6686758B1Engagement probe and apparatuses configured to engage a conductive padMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 3, 2004·13 cites·16 claims
- 0980US4936950AMethod of forming a configuration of interconnections on a semiconductor device having a high integration densityPHILIPS CORP·Filed 1989·Granted Jun 26, 1990·54 cites·6 claims
- 1079US6392426B2Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2001·Granted May 21, 2002·10 cites·21 claims
- 1178US6960115B2Multiprobe detection system for chemical-mechanical planarization toolSPEEDFAM IPEC CORP·Filed 2003·Granted Nov 1, 2005·19 cites·24 claims
- 1276US6805613B1Multiprobe detection system for chemical-mechanical planarization toolSPEEDFAM IPEC CORP·Filed 2000·Granted Oct 19, 2004·17 cites·29 claims
- 1374US6614249B1Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 2, 2003·7 cites·15 claims
- 1473US9318400B2Wafer-scale package including power sourceMEDTRONIC INC·Filed 2014·Granted Apr 19, 2016·2 cites·12 claims
- 1572US5136362AElectrical contact with diffusion barrierGRIEF MALCOLM K·Filed 1990·Granted Aug 4, 1992·54 cites·31 claims
- 1669US10109493B2Composite abrasive particles for chemical mechanical planarization composition and method of use thereofAIR PROD & CHEM·Filed 2016·Granted Oct 23, 2018·1 cites·21 claims
- 1767US10669449B2Composite abrasive particles for chemical mechanical planarization composition and method of use thereofVERSUM MAT US LLC·Filed 2018·Granted Jun 2, 2020·0 cites·21 claims
- 1867US5166093AMethod to reduce the reflectivity of a semi-conductor metallic surfaceMICRON TECHNOLOGY INC·Filed 1991·Granted Nov 24, 1992·39 cites·9 claims
- 1963US6670819B2Methods of engaging electrically conductive pads on a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 30, 2003·3 cites·15 claims
- 2061US6833727B2Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operabilityMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 21, 2004·3 cites·11 claims
- 2158US7098475B2Apparatuses configured to engage a conductive padMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 29, 2006·2 cites·27 claims
- 2257US6124721AMethod of engaging electrically conductive test pads on a semiconductor substrateMICRON TECHNOLOGY INC·Filed 1997·Granted Sep 26, 2000·7 cites·12 claims
- 2354US9431312B2Wafer-scale package including power sourceMEDTRONIC INC·Filed 2016·Granted Aug 30, 2016·0 cites·6 claims
- 2454US7330036B2Engagement ProbesMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 12, 2008·1 cites·26 claims
- 2550US6555466B1Two-step chemical-mechanical planarization for damascene structures on semiconductor wafersSPEEDFAM CORP·Filed 1999·Granted Apr 29, 2003·17 cites·3 claims
- 2647US7116118B2Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operabilityMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 3, 2006·0 cites·21 claims
- 2746US6657450B2Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probesMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 2, 2003·4 cites·13 claims
- 2845US6462571B1Engagement probesMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 8, 2002·0 cites·20 claims
- 2944US6573740B2Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrateMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 3, 2003·0 cites·17 claims
- 3043US10745589B2Chemical mechanical polishing (CMP) of cobalt-containing substrateVERSUM MAT US LLC·Filed 2017·Granted Aug 18, 2020·0 cites·19 claims
- 3142US2001015655A1Removable electrical interconnect apparatuses and removable engagement probesFiled 2001·Application pending·0 cites
- 3237USRE34583EMethod of forming a configuration of interconnections on a semiconductor device having a high integration densityPHILIPS CORP·Filed 1992·Granted Apr 12, 1994·10 cites·6 claims
- 3335US6380754B1Removable electrical interconnect apparatuses including an engagement probleMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 30, 2002·1 cites·33 claims
- 3435US6127195AMethods of forming an apparatus for engaging electrically conductive pads and method of forming a removable electrical interconnect apparatusMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 3, 2000·1 cites·6 claims
- 3533US6387188B1Pad conditioning for copper-based semiconductor wafersSPEEDFAM IPEC CORP·Filed 1999·Granted May 14, 2002·5 cites·5 claims
- 3633US2016122590A1Chemical Mechanical Polishing Slurry for Reducing Corrosion and Method of Use ThereforAIR PROD & CHEM·Filed 2015·Application pending·0 cites
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