Inventor · disambiguated record

Wilhelm R. Lapointe

Also filed as: LAPOINTE WILHELM · LAPOINTE WILHELM R

1 granted patent·1 pending application·2 citations·filing 2008–2017

21Inventor score

Technology areasB23K G06F

Files withSIMMONDS PRECISION PRODUCTS1 SUSS MICROTEC AG1

Top patents by PatentIndex Score

2 records

0162US7790596B2Apparatus and method for semiconductor wafer bumping via injection molded solderSUSS MICROTEC AG·Filed 2008·Granted Sep 7, 2010·2 cites·12 claims
0227US2018300383A1Auto-export of health and usage management system dataSIMMONDS PRECISION PRODUCTS·Filed 2017·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →